Inventor · disambiguated record
Masaharu Minamizawa
Also filed as: MINAMIZAWA MASAHARU
17 granted patents·3 pending applications·592 citations·filing 1994–2008
96Inventor score
Top patents by PatentIndex Score
20 records- 0193US6794273B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2002·Granted Sep 21, 2004·81 cites·8 claims
- 0289US6875638B2Manufacturing method of a semiconductor device incorporating a passive element and a redistribution boardFUJITSU LTD·Filed 2002·Granted Apr 5, 2005·44 cites·16 claims
- 0388US6995044B2Manufacturing method of a semiconductor device incorporating a passive element and a redistribution boardFUJITSU LTD·Filed 2003·Granted Feb 7, 2006·36 cites·8 claims
- 0488US6781224B2Semiconductor device and package including forming pyramid mount protruding through silicon substrateFUJITSU LTD·Filed 2002·Granted Aug 24, 2004·42 cites·12 claims
- 0587US6347037B2Semiconductor device and method of forming the sameFUJITSU LTD·Filed 1998·Granted Feb 12, 2002·99 cites·14 claims
- 0685US6566748B1Flip-chip semiconductor device having an improved reliabilityFUJITSU LTD·Filed 2000·Granted May 20, 2003·42 cites·11 claims
- 0785US5666270ABump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrodeFUJITSU LTD·Filed 1994·Granted Sep 9, 1997·88 cites·20 claims
- 0883US6184133B1Method of forming an assembly board with insulator filled through holesFUJITSU LTD·Filed 2000·Granted Feb 6, 2001·26 cites·7 claims
- 0978US7193320B2Semiconductor device having a heat spreader exposed from a seal resinFUJITSU LTD·Filed 2003·Granted Mar 20, 2007·24 cites·12 claims
- 1075US7754534B2Semiconductor device and manufacturing method thereofFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Jul 13, 2010·5 cites·27 claims
- 1164US5729435ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1997·Granted Mar 17, 1998·22 cites·6 claims
- 1263US6905951B2Method of forming a device substrate and semiconductor package including a pyramid contactFUJITSU LTD·Filed 2004·Granted Jun 14, 2005·9 cites·6 claims
- 1362US5937277ASemiconductor device with reliable electrodes of projecting shape and method of forming sameFUJITSU LTD·Filed 1997·Granted Aug 10, 1999·18 cites·7 claims
- 1456US5607877AProjection-electrode fabrication methodFUJITSU LTD·Filed 1994·Granted Mar 4, 1997·23 cites·3 claims
- 1550US6088233ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1998·Granted Jul 11, 2000·11 cites·11 claims
- 1649US5978222ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1997·Granted Nov 2, 1999·11 cites·9 claims
- 1749US5637535ASemiconductor device with reliable electrodes of projecting shape and method of forming sameFUJITSU LTD·Filed 1995·Granted Jun 10, 1997·11 cites·16 claims
- 1847US2007114642A1Semiconductor device having a heat spreader exposed from a seal resinFUJITSU LTD·Filed 2007·Application pending·0 cites
- 1941US2004232549A1Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2035US2007004091A1Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →