Inventor · disambiguated record
Man Kit Mui
Also filed as: MUI MAN KIT
4 granted patents·18 citations·filing 2010–2022
70Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0179US8657181B2Wedge bonder and a method of cleaning a wedge bonderCHENG CHI WAH·Filed 2012·Granted Feb 25, 2014·6 cites·20 claims
- 0279US8434669B1Universal bond head for wire bondersCHENG CHI WAH·Filed 2012·Granted May 7, 2013·6 cites·8 claims
- 0377US8091762B1Wedge bonding method incorporating remote pattern recognition systemCHENG CHI WAH·Filed 2010·Granted Jan 10, 2012·6 cites·15 claims
- 0456US11842978B1Wire bonding system including a wire biasing toolASMPT SINGAPORE PTE LTD·Filed 2022·Granted Dec 12, 2023·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →