Inventor · disambiguated record
Masanori Nakayama
Also filed as: NAKAYAMA MASANORI
32 granted patents·13 pending applications·418 citations·filing 1999–2024
95Inventor score
Files withKOKUSAI ELECTRIC CORP21HITACHI INT ELECTRIC INC17DAINIPPON SCREEN MFG1KUROISHI IRON WORKS CO LTD1MAX PLANCK GESELLSCHAFT1
Top patents by PatentIndex Score
45 records- 0198US9929005B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Mar 27, 2018·345 cites·7 claims
- 0294US11905596B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 20, 2024·2 cites·12 claims
- 0393US9431220B1Substrate processing apparatus and substrate processing systemHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 30, 2016·10 cites·15 claims
- 0482US12195854B2Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Jan 14, 2025·0 cites·20 claims
- 0581US6817264B2Parking brake operating device for vehicleKUROISHI IRON WORKS CO LTD·Filed 2001·Granted Nov 16, 2004·22 cites·4 claims
- 0678US11664275B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted May 30, 2023·1 cites·9 claims
- 0778US11145491B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Oct 12, 2021·1 cites·16 claims
- 0877US12154826B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 26, 2024·0 cites·18 claims
- 0976US2025022753A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1073US6198070B1Laser beam machining method and laser beam machineNIPPEI TOYAMA CORP·Filed 1999·Granted Mar 6, 2001·32 cites·14 claims
- 1170US10671056B2Substrate processing systemHITACHI INT ELECTRIC INC·Filed 2017·Granted Jun 2, 2020·1 cites·17 claims
- 1268US11384431B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Granted Jul 12, 2022·1 cites·18 claims
- 1368US9059229B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2013·Granted Jun 16, 2015·2 cites·7 claims
- 1467US9735068B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 15, 2017·1 cites·16 claims
- 1564US2024294924A1Antisense-oligonucleotides for prevention of kidney dysfunction promoted by endothelial dysfunction by ephrin-b2 suppressionMAX PLANCK GESELLSCHAFT·Filed 2022·Application pending·0 cites
- 1660US12106998B2Substrate processing apparatus, substrate processing method, non-transitory computer-readable recording medium and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Oct 1, 2024·0 cites·11 claims
- 1760US11726456B2Substrate processing systemKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 15, 2023·0 cites·17 claims
- 1860US11155922B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 26, 2021·0 cites·6 claims
- 1958US2024234132A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2056US2024243019A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2155US12040161B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 16, 2024·0 cites·13 claims
- 2254US11908682B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 2350US2023097621A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2448US7073445B2Illuminating device for a scanner, and a print reading apparatus using the sameDAINIPPON SCREEN MFG·Filed 2004·Granted Jul 11, 2006·0 cites·7 claims
- 2548US2022301863A1Method of manufacturing semiconductor device, method of processing substrate, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2647US11081362B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 3, 2021·0 cites·17 claims
- 2747US10796900B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Oct 6, 2020·0 cites·15 claims
- 2846US2022139675A1Method of Manufacturing Semiconductor Device, Substrate Processing Method, Non-transitory Computer-readable Recording Medium and Substrate Processing ApparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2946US2021305045A1Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 3044US10355098B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 16, 2019·0 cites·16 claims
- 3144US10090322B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Oct 2, 2018·0 cites·8 claims
- 3244US9966238B2Method for manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted May 8, 2018·0 cites·16 claims
- 3344US9831249B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 28, 2017·0 cites·17 claims
- 3443US11189483B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 30, 2021·0 cites·8 claims
- 3542US11152476B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 19, 2021·0 cites·17 claims
- 3642US10910214B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Feb 2, 2021·0 cites·14 claims
- 3742US7795156B2Producing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2005·Granted Sep 14, 2010·0 cites·7 claims
- 3840US9978653B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted May 22, 2018·0 cites·18 claims
- 3940US2013078789A1Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording MediumHITACHI INT ELECTRIC INC·Filed 2012·Application pending·0 cites
- 4040US2009050056A1Substrate processing apparatus and semiconductor manufacturing method thereofOGAWA UNRYU·Filed 2008·Application pending·0 cites
- 4139US12506002B2Method of manufacturing semiconductor device using plasma to modify surface of silicon-containing films exposed in trench structure, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Dec 23, 2025·0 cites·14 claims
- 4238US10453676B2Semiconductor device manufacturing method and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Oct 22, 2019·0 cites·9 claims
- 4338US2012071002A1Method of manufacturing semiconductor device and substrate processing apparatusNAKAYAMA MASANORI·Filed 2011·Application pending·0 cites
- 4436US2017040232A1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
- 4535US2008096395A1Producing Method of Semiconductor DeviceTERASAKI TADASHI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →