Inventor · disambiguated record
Markus Naujok
Also filed as: NAUJOK MARKUS
12 granted patents·4 pending applications·110 citations·filing 2002–2014
90Inventor score
Top patents by PatentIndex Score
16 records- 0197US7201634B1Polishing methods and apparatusINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 10, 2007·48 cites·24 claims
- 0283US6761620B2Finishing pad design for multidirectional useINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 13, 2004·22 cites·17 claims
- 0381US9401322B2Semiconductor devices and structures thereofNAUJOK MARKUS·Filed 2011·Granted Jul 26, 2016·5 cites·24 claims
- 0478US7629225B2Methods of manufacturing semiconductor devices and structures thereofINFINEON TECHNOLOGIES AG·Filed 2005·Granted Dec 8, 2009·6 cites·28 claims
- 0577US8822324B2Passivated copper chip padsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 2, 2014·3 cites·18 claims
- 0666US8013364B2Semiconductor devices and structures thereofINFINEON TECHNOLOGIES AG·Filed 2009·Granted Sep 6, 2011·2 cites·20 claims
- 0763US8148235B2Methods of manufacturing semiconductor devicesNAUJOK MARKUS·Filed 2009·Granted Apr 3, 2012·2 cites·46 claims
- 0863US6602123B1Finishing pad design for multidirectional useINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 5, 2003·8 cites·16 claims
- 0960US7282451B2Methods of forming integrated circuit devices having metal interconnect layers thereinINFINEON TECHNOLOGIES AG·Filed 2005·Granted Oct 16, 2007·1 cites·26 claims
- 1058US7091612B2Dual damascene structure and methodIBM·Filed 2003·Granted Aug 15, 2006·8 cites·26 claims
- 1156US9373596B2Passivated copper chip padsINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 21, 2016·0 cites·19 claims
- 1254US7041574B2Composite intermetal dielectric structure including low-k dielectric materialINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 9, 2006·5 cites·14 claims
- 1349US2009200675A1Passivated Copper Chip PadsGOEBEL THOMAS·Filed 2008·Application pending·0 cites
- 1439US2004248400A1Composite low-k dielectric structureFiled 2003·Application pending·0 cites
- 1537US2004152402A1Wafer polishing with counteraction of centrifugal forces on polishing slurryFiled 2003·Application pending·0 cites
- 1636US2006079159A1Chemical mechanical polish with multi-zone abrasive-containing matrixNAUJOK MARKUS·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →