Inventor · disambiguated record
Martin Richard Niessner
Also filed as: NIESSNER MARTIN RICHARD
7 granted patents·1 pending application·16 citations·filing 2015–2023
75Inventor score
Files withINFINEON TECHNOLOGIES AG8
Top patents by PatentIndex Score
8 records- 0191US10317512B2RF system with an RFIC and antenna systemINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jun 11, 2019·9 cites·26 claims
- 0290US10408919B2RF system with an RFIC and antenna systemINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 10, 2019·7 cites·20 claims
- 0356US11862582B2Package with elevated lead and structure extending vertically from encapsulant bottomINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 2, 2024·0 cites·16 claims
- 0453US2024258372A1Electronic component and package including stress release structure as lateral edge portion of semiconductor bodyINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0551US11251146B2Semiconductor devices having a non-galvanic connectionINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 0644US12368111B2Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methodsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 22, 2025·0 cites·20 claims
- 0741US10916484B2Electronic device including redistribution layer pad having a voidINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 9, 2021·0 cites·21 claims
- 0830US10607911B2Chip carrier laminate with high frequency dielectric and thermomechanical bufferINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 31, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →