Inventor · disambiguated record
Masaya Nishida
Also filed as: NISHIDA MASAYA
8 granted patents·9 pending applications·21 citations·filing 1999–2024
79Inventor score
Files withKOKUSAI ELECTRIC CORP10HITACHI INT ELECTRIC INC2NISSAN MOTOR2UNIV NAGOYA CITY PUBLIC UNIV CORP2MURATA MANUFACTURING CO1
Top patents by PatentIndex Score
17 records- 0177US9394607B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 19, 2016·3 cites·15 claims
- 0268US11728159B2Method of manufacturing semiconductor device, surface treatment method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Aug 15, 2023·0 cites·26 claims
- 0368US2024331673A1Acoustic transmission enhancer and acoustic transmission enhancement systemMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 0465US2025304816A1Immobilized two-dimensional colloid crystal and method for producing sameUNIV NAGOYA CITY PUBLIC UNIV CORP·Filed 2023·Application pending·0 cites
- 0559US2023307229A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0658US11257669B2Method of manufacturing semiconductor device, surface treatment method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Feb 22, 2022·0 cites·22 claims
- 0758US6343583B1Intake manifold of internal combustion engineNISSAN MOTOR·Filed 2000·Granted Feb 5, 2002·9 cites·30 claims
- 0857US12461507B2Substrate processing apparatus, substrate processing method, semiconductor device manufacturing method, and control programKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 4, 2025·0 cites·18 claims
- 0957US2024363334A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1054US2023144886A1Method of manufacturing semiconductor device, method of managing parts, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1154US2025230573A1Colloidal crystal and production method thereforUNIV NAGOYA CITY PUBLIC UNIV CORP·Filed 2022·Application pending·0 cites
- 1253US2023307225A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1351US2023392257A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, recording medium, and exhaust systemKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1449US2015370245A1Substrate processing apparatus, substrate processing method, semiconductor device manufacturing method, and control programHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 1546US11535931B2Method of manufacturing semiconductor device, method of managing parts, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Dec 27, 2022·0 cites·13 claims
- 1643US11035721B2Substrate processing apparatus, vibration detection system and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jun 15, 2021·0 cites·10 claims
- 1738US6267091B1Rotary valve assembly and engine induction system using the rotary valve assemblyNISSAN MOTOR·Filed 1999·Granted Jul 31, 2001·9 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →