Inventor · disambiguated record
Masayoshi Nishihata
Also filed as: NISHIHATA MASAYOSHI
21 granted patents·6 pending applications·40 citations·filing 2010–2023
92Inventor score
Top patents by PatentIndex Score
27 records- 0191US11973432B2Power conversion apparatusDENSO CORP·Filed 2022·Granted Apr 30, 2024·2 cites·3 claims
- 0291US8884411B2Semiconductor device and manufacturing method thereofKADOGUCHI TAKUYA·Filed 2012·Granted Nov 11, 2014·15 cites·21 claims
- 0384US9070666B2Semiconductor device including coolerDENSO CORP·Filed 2014·Granted Jun 30, 2015·5 cites·1 claims
- 0477US9224662B2Semiconductor apparatusTOYOTA MOTOR CO LTD·Filed 2014·Granted Dec 29, 2015·4 cites·10 claims
- 0572US8957517B2Semiconductor device including coolerDENSO CORP·Filed 2013·Granted Feb 17, 2015·2 cites·2 claims
- 0670US8558375B2Semiconductor package cooled by grounded coolerMAMITSU KUNIAKI·Filed 2011·Granted Oct 15, 2013·2 cites·4 claims
- 0768US8441122B2Semiconductor device having semiconductor chip and metal plateFUKUOKA DAISUKE·Filed 2010·Granted May 14, 2013·3 cites·3 claims
- 0865US8405194B2Semiconductor device including two heat sinks and method of manufacturing the sameNISHIHATA MASAYOSHI·Filed 2010·Granted Mar 26, 2013·3 cites·29 claims
- 0964US8497572B2Semiconductor module and method of manufacturing the sameFUKUTANI KEITA·Filed 2011·Granted Jul 30, 2013·3 cites·26 claims
- 1060US12476172B2Semiconductor deviceDENSO CORP·Filed 2022·Granted Nov 18, 2025·0 cites·10 claims
- 1159US10103090B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2015·Granted Oct 16, 2018·1 cites·12 claims
- 1259US2024145349A1Semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 1357US2023317599A1Semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 1456US8884426B2Semiconductor device including coolerDENSO CORP·Filed 2014·Granted Nov 11, 2014·0 cites·2 claims
- 1554US11545419B2Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminalsTOYOTA MOTOR CO LTD·Filed 2019·Granted Jan 3, 2023·0 cites·5 claims
- 1652US2016225690A1Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 1751US11973433B2Power conversion apparatusDENSO CORP·Filed 2022·Granted Apr 30, 2024·0 cites·3 claims
- 1851US2016315037A1Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 1948US9831160B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2017·Granted Nov 28, 2017·0 cites·3 claims
- 2047US11990391B2Semiconductor deviceDENSO CORP·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 2144US10797569B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Oct 6, 2020·0 cites·7 claims
- 2244US2016343630A1Semiconductor device and manufacturing method of the sameTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 2343US9406593B2Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatusKADOGUCHI TAKUYA·Filed 2014·Granted Aug 2, 2016·0 cites·8 claims
- 2443US8994167B2Semiconductor deviceKADOGUCHI TAKUYA·Filed 2012·Granted Mar 31, 2015·0 cites·6 claims
- 2539US2016322726A1Terminal connecting structure and semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 2638US10985636B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Apr 20, 2021·0 cites·8 claims
- 2736US9711884B2Terminal connection structure and semiconductor apparatusNISHIHATA MASAYOSHI·Filed 2015·Granted Jul 18, 2017·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →