Inventor · disambiguated record
Masaru Nishinaka
Also filed as: NISHINAKA MASARU
12 granted patents·6 pending applications·126 citations·filing 1998–2006
91Inventor score
Top patents by PatentIndex Score
18 records- 0188US7115681B2Resin compositionKANEKA CORP·Filed 2002·Granted Oct 3, 2006·29 cites·8 claims
- 0286US6586081B1Polyimide/metal laminate, and electric/electronic equipment bases, magnetic recording bases, solar battery bases, coating film for aerospace materials and filmy resistance elements with the use thereofKANEKA CORP·Filed 2000·Granted Jul 1, 2003·32 cites·16 claims
- 0379US7101619B2LaminateKANEKA CORP·Filed 2005·Granted Sep 5, 2006·9 cites·5 claims
- 0469US8313831B2Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of sameTANAKA SHIGERU·Filed 2003·Granted Nov 20, 2012·6 cites·4 claims
- 0569US8092900B2Solution, component for plating, insulating sheet, laminate, and printed circuit boardSHIMOOSAKO KANJI·Filed 2005·Granted Jan 10, 2012·5 cites·1 claims
- 0667US6911265B2LaminateKANEKA CORP·Filed 2001·Granted Jun 28, 2005·11 cites·15 claims
- 0765US7247367B2Polyimide film and process for producing the sameKANEKA CORP·Filed 2002·Granted Jul 24, 2007·6 cites·2 claims
- 0862US7662429B2Laminate comprising polyimide and conductor layer, multi-layer wiring board with the use of the same and process for producing the sameKANEKA CORP·Filed 2001·Granted Feb 16, 2010·1 cites·17 claims
- 0956US6207739B1Polyamide acid composition containing metal, polyimide film, flexible printed wiring board and method for producing themKANEGAFUCHI CHEMICAL IND·Filed 1998·Granted Mar 27, 2001·20 cites·28 claims
- 1054US7179519B2Polyimide/metal laminate, and electric/electronic equipment bases, magnetic recording bases, solar battery bases, coating film for aerospace materials and filmy resistance elements with the use thereofKANEKA CORP·Filed 2003·Granted Feb 20, 2007·4 cites·19 claims
- 1154US2006138707A1Polyimide film, process for preparing the same and controlling isotropy of the sameKANEKA CORP·Filed 2006·Application pending·0 cites
- 1251US7252881B2Multilayer structure and multilayer wiring board using the sameKANEKA CORP·Filed 2001·Granted Aug 7, 2007·3 cites·26 claims
- 1351US2006048963A1Laminate, printed circuit board, and preparing method thereofNISHINAKA MASARU·Filed 2003·Application pending·0 cites
- 1449US2009025966A1Fiber-resin composite, laminate, printed wiring board, and method for manufacturing printed wiring boardSHIMOOSAKO KANJI·Filed 2006·Application pending·0 cites
- 1547US8889250B2Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using themSHIMOOSAKO KANJI·Filed 2005·Granted Nov 18, 2014·0 cites·5 claims
- 1647US2009281267A1Material for planting and use thereofSHIMOOSAKO KANJI·Filed 2006·Application pending·0 cites
- 1742US2004087757A1Polyimide film and method for production thereof and method for adjusting isotropy thereofFiled 2001·Application pending·0 cites
- 1835US2004231141A1Laminate and its producing methodFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →