Inventor · disambiguated record
Masaaki Ogawa
Also filed as: OGAWA MASAAKI
28 granted patents·15 pending applications·211 citations·filing 1977–2024
96Inventor score
Top patents by PatentIndex Score
43 records- 0194US7767485B2Solid-state imaging device and method for manufacturing sameTOSHIBA KK·Filed 2009·Granted Aug 3, 2010·33 cites·16 claims
- 0287US7432530B2Solid-state imaging device and method of manufacturing sameTOSHIBA KK·Filed 2007·Granted Oct 7, 2008·10 cites·14 claims
- 0384US8680561B2Semiconductor light emitting device and method for manufacturing sameKITAGAWA RYOTA·Filed 2011·Granted Mar 25, 2014·5 cites·10 claims
- 0476US7497783B2Propeller shaftTOYOTA MOTOR CO LTD·Filed 2006·Granted Mar 3, 2009·6 cites·10 claims
- 0573US9444012B2Semiconductor light emitting device and method for manufacturing the sameASAKAWA KOJI·Filed 2011·Granted Sep 13, 2016·2 cites·13 claims
- 0671US7550792B2Solid-state imaging device and manufacturing method thereofTOSHIBA KK·Filed 2007·Granted Jun 23, 2009·2 cites·12 claims
- 0769US2022181933A1Rotor, motor, and electric power steering deviceNIDEC CORP·Filed 2022·Application pending·0 cites
- 0868US8853711B2Semiconductor light emitting device and method for manufacturing sameFUJIMOTO AKIRA·Filed 2011·Granted Oct 7, 2014·1 cites·17 claims
- 0966US6537630B1Bow-molded hoses and apparatuses for producing the sameTIGERS POLYMER·Filed 2000·Granted Mar 25, 2003·5 cites·6 claims
- 1065US11289963B2Rotor, motor, and electric power steering deviceNIDEC CORP·Filed 2018·Granted Mar 29, 2022·0 cites·11 claims
- 1165US7768286B2Electronic device testing apparatus and temperature control method in an electronic device testing apparatusADVANTEST CORP·Filed 2005·Granted Aug 3, 2010·3 cites·11 claims
- 1263US2025316488A1Semiconductor device manufacturing methodTOSHIBA KK·Filed 2024·Application pending·0 cites
- 1362US5163894AFemale die for paperboard stamperOGAWA MASAAKI·Filed 1991·Granted Nov 17, 1992·23 cites·14 claims
- 1461US5250140ADevice having raised side edge portions for heat-sealing tubular packaging materialSHIKOKU KAKOKI CO LTD·Filed 1991·Granted Oct 5, 1993·24 cites·5 claims
- 1561US2025079240A1Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2024·Application pending·0 cites
- 1660US6730261B2Processes for producing hollow molded articlesTIGERS POLYMER·Filed 2001·Granted May 4, 2004·3 cites·11 claims
- 1759US8875684B2Evaporated fuel treatment device for motorcycleKONDO NOBUYUKI·Filed 2012·Granted Nov 4, 2014·2 cites·13 claims
- 1857US5589205AApparatus for manufacturing hollow resin productsTIGERS POLYMER·Filed 1994·Granted Dec 31, 1996·17 cites·9 claims
- 1954US6660217B2Blow molding methodTIGERS POLYMER·Filed 2001·Granted Dec 9, 2003·1 cites·7 claims
- 2054US5785920AExtrusion molding apparatus and method of forming a parisonTIGERS POLYMER·Filed 1996·Granted Jul 28, 1998·16 cites·5 claims
- 2153US8813724B2Evaporated fuel treatment device for motorcycleKONDO NOBUYUKI·Filed 2012·Granted Aug 26, 2014·2 cites·7 claims
- 2248US6214268B1Blow-molded hoses and apparatuses for producing the sameTIGERS POLYMER·Filed 1998·Granted Apr 10, 2001·10 cites·2 claims
- 2348US2007078067A1Sliding structure and sliding methodTOYOTA MOTOR CO LTD·Filed 2006·Application pending·0 cites
- 2446US5269168ATransfer feederKOMATSU MFG CO LTD·Filed 1991·Granted Dec 14, 1993·8 cites·10 claims
- 2545US6168002B1Control system for use with semiconductor device transporting and handling apparatusADVANTEST CORP·Filed 1997·Granted Jan 2, 2001·11 cites·17 claims
- 2645US5637894ASolid state image sensor device with single-layered transfer electrodesTOSHIBA KK·Filed 1995·Granted Jun 10, 1997·12 cites·3 claims
- 2744US9200601B2Evaporated fuel treatment device for motorcycleKONDO NOBUYUKI·Filed 2012·Granted Dec 1, 2015·0 cites·8 claims
- 2844US5601779AMethod for manufacturing hollow resin productsTIGERS POLYMER·Filed 1995·Granted Feb 11, 1997·9 cites·7 claims
- 2944US2007141347A1Hard carbon film, production method thereof, and sliding memberTOYOTA MOTOR CO LTD·Filed 2006·Application pending·0 cites
- 3042US2012061640A1Semiconductor light emitting deviceKITAGAWA RYOTA·Filed 2011·Application pending·0 cites
- 3140US2014035030A1Semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 3240US2011042680A1Light emitting device and method for manufacturing sameTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3338US2011215356A1Light emitting element, light emitting device, and method for manufacturing light emitting elementTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3437US2012132948A1Semiconductor light emitting device and method for manufacturing the sameNUNOTANI SHINJI·Filed 2011·Application pending·0 cites
- 3536US2012070958A1Method of manufacturing semiconductor deviceFURUKAWA KAZUYOSHI·Filed 2011·Application pending·0 cites
- 3635US12061936B2Computer system and program execution methodHITACHI LTD·Filed 2020·Granted Aug 13, 2024·0 cites·7 claims
- 3735US5730278ATransfer feederKOMATSU MFG CO LTD·Filed 1994·Granted Mar 24, 1998·3 cites·6 claims
- 3834US2016268219A1Semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 3934US2016268409A1Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2015·Application pending·0 cites
- 4033US9583577B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2015·Granted Feb 28, 2017·0 cites·6 claims
- 4132US2016079371A1Semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 4232US2016079382A1Semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 4327US4143779ACan end feederHITACHI SHIPBUILDING ENG CO·Filed 1977·Granted Mar 13, 1979·3 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →