Inventor · disambiguated record
Masaaki Ogino
Also filed as: OGINO MASAAKI
22 granted patents·2 pending applications·165 citations·filing 1989–2016
93Inventor score
Top patents by PatentIndex Score
24 records- 0191US6056656AV-ribbed beltBANDO CHEMICAL IND·Filed 1998·Granted May 2, 2000·60 cites·5 claims
- 0284US9666676B2Method for manufacturing a semiconductor device by exposing, to a hydrogen plasma atmosphere, a semiconductor substrateFUJI ELECTRIC CO LTD·Filed 2015·Granted May 30, 2017·4 cites·20 claims
- 0380US9659774B2Impurity introducing method, impurity introducing apparatus, and method of manufacturing semiconductor elementFUJI ELECTRIC CO LTD·Filed 2015·Granted May 23, 2017·3 cites·22 claims
- 0477US4926902APressure equalizer valve device of fuel injection pumpDIESEL KIKI CO·Filed 1989·Granted May 22, 1990·32 cites·23 claims
- 0575US10658183B2Impurity adding apparatus, impurity adding method, and semiconductor element manufacturing methodFUJI ELECTRIC CO LTD·Filed 2016·Granted May 19, 2020·2 cites·13 claims
- 0675US9564334B2Method of manufacturing a semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Feb 7, 2017·2 cites·9 claims
- 0775US9548205B2Method of manufacturing a semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Jan 17, 2017·2 cites·9 claims
- 0874US8399309B2Semiconductor device manufacturing methodOGINO MASAAKI·Filed 2011·Granted Mar 19, 2013·5 cites·24 claims
- 0967US8604584B2Semiconductor device and method of manufacturing semiconductor deviceWAKIMOTO HIROKI·Filed 2011·Granted Dec 10, 2013·2 cites·6 claims
- 1066US10355089B2Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2015·Granted Jul 16, 2019·1 cites·12 claims
- 1166US5417619ACanvas-rubber complex, V-ribbed belt using it and method of producing V-ribbed beltBANDO CHEMICAL IND·Filed 1994·Granted May 23, 1995·24 cites·9 claims
- 1265US5501908ARubber composition and transmission belt using the sameBANDO CHEMICAL IND·Filed 1994·Granted Mar 26, 1996·24 cites·12 claims
- 1364US9972499B2Method for forming metal-semiconductor alloy using hydrogen plasmaFUJI ELECTRIC CO LTD·Filed 2016·Granted May 15, 2018·1 cites·14 claims
- 1464US9431270B2Method for producing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Aug 30, 2016·1 cites·6 claims
- 1564US8999768B2Semiconductor device manufacturing methodNAKAZAWA HARUO·Filed 2011·Granted Apr 7, 2015·1 cites·9 claims
- 1663US9892919B2Semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2015·Granted Feb 13, 2018·1 cites·15 claims
- 1754US9355858B2Method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted May 31, 2016·0 cites·15 claims
- 1849US9905684B2Semiconductor device having schottky junction between substrate and drain electrodeFUJI ELECTRIC CO LTD·Filed 2015·Granted Feb 27, 2018·0 cites·14 claims
- 1946US9450070B2Method for manufacturing a silicon semiconductor substrate including a diffusion layer prior to forming a semiconductor device thereonFUJI ELECTRIC CO LTD·Filed 2014·Granted Sep 20, 2016·0 cites·22 claims
- 2042US2014361312A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Application pending·0 cites
- 2140US10115587B2Method of manufacturing semiconductor deviceNAKAZAWA HARUO·Filed 2012·Granted Oct 30, 2018·0 cites·8 claims
- 2239US8501549B2Method of manufacturing a reverse blocking insulated gate bipolar transistorOGINO MASAAKI·Filed 2012·Granted Aug 6, 2013·0 cites·7 claims
- 2336US2007184617A1Method for manufacturing semiconductor deviceFUJI ELECTRIC HOLDINGS CO INC·Filed 2005·Application pending·0 cites
- 2435US9240456B2Method for manufacturing semiconductor deviceWAKIMOTO HIROKI·Filed 2011·Granted Jan 19, 2016·0 cites·21 claims
Join the waitlist — get patent alerts
Get an alert when Masaaki Ogino files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →