Inventor · disambiguated record
Masahiko Ogino
Also filed as: OGINO MASAHIKO
72 granted patents·35 pending applications·1,177 citations·filing 1995–2022
99Inventor score
Files withHITACHI LTD30OGINO MASAHIKO9RENESAS TECH CORP8HITACHI INDUSTRY EQUIPMENT SYSTEMS CO LTD7WASHIYA RYUTA7
Top patents by PatentIndex Score
107 records- 0195US8741380B2Fine metal structure, process for producing the same, fine metal mold and deviceYOSHIDA HIROSHI·Filed 2010·Granted Jun 3, 2014·12 cites·9 claims
- 0294US6028364ASemiconductor device having a stress relieving mechanismHITACHI LTD·Filed 1995·Granted Feb 22, 2000·167 cites·19 claims
- 0392US7745237B2Pattern forming method and pattern forming systemHITACHI LTD·Filed 2007·Granted Jun 29, 2010·15 cites·17 claims
- 0492US7654815B2Belt-shaped mold and nanoimprint system using the belt-shaped moldHITACHI LTD·Filed 2008·Granted Feb 2, 2010·15 cites·15 claims
- 0591US6627997B1Semiconductor module and method of mountingHITACHI LTD·Filed 1999·Granted Sep 30, 2003·124 cites·8 claims
- 0691US6621154B1Semiconductor apparatus having stress cushioning layerHITACHI LTD·Filed 2000·Granted Sep 16, 2003·65 cites·29 claims
- 0789US8288079B2Photocurable resin composition and a method for forming a patternOGINO MASAHIKO·Filed 2007·Granted Oct 16, 2012·15 cites·21 claims
- 0889US6114005ALaminate and multilayer printed circuit boardHITACHI LTD·Filed 1997·Granted Sep 5, 2000·98 cites·19 claims
- 0988US6114753ACircuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 1997·Granted Sep 5, 2000·50 cites·23 claims
- 1088US5677045ALaminate and multilayer printed circuit boardHITACHI LTD·Filed 1995·Granted Oct 14, 1997·86 cites·8 claims
- 1187US6784541B2Semiconductor module and mounting method for sameHITACHI LTD·Filed 2002·Granted Aug 31, 2004·37 cites·10 claims
- 1286US7586755B2Electronic circuit componentHITACHI LTD·Filed 2007·Granted Sep 8, 2009·11 cites·7 claims
- 1386US6710446B2Semiconductor device comprising stress relaxation layers and method for manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Mar 23, 2004·44 cites·10 claims
- 1485US8770965B2Device and method for transferring micro structureWASHIYA RYUTA·Filed 2012·Granted Jul 8, 2014·5 cites·17 claims
- 1584US8603380B2Stamper for transferring fine pattern and method for manufacturing thereofISHII SATOSHI·Filed 2012·Granted Dec 10, 2013·4 cites·8 claims
- 1684US8387255B2Fine pattern moldOGINO MASAHIKO·Filed 2011·Granted Mar 5, 2013·7 cites·3 claims
- 1784US8109751B2Imprint device and microstructure transfer methodANDO TAKASHI·Filed 2007·Granted Feb 7, 2012·6 cites·24 claims
- 1883US8632714B2Mold structures, and method of transfer of fine structuresOGINO MASAHIKO·Filed 2012·Granted Jan 21, 2014·4 cites·3 claims
- 1983US7935472B2Photo-curable resin composition and a method for forming a pattern using the sameHITACHI CHEMICAL CO LTD·Filed 2006·Granted May 3, 2011·11 cites·9 claims
- 2083US6423571B2Method of making a semiconductor device having a stress relieving mechanismHITACHI LTD·Filed 2001·Granted Jul 23, 2002·35 cites·19 claims
- 2181US7520742B2Nanoprint equipment and method of making fine structureHITACHI LTD·Filed 2004·Granted Apr 21, 2009·30 cites·8 claims
- 2280US8186992B2Micropattern transfer deviceWASHIYA RYUTA·Filed 2010·Granted May 29, 2012·6 cites·2 claims
- 2380US6940162B2Semiconductor module and mounting method for sameRENESAS TECH CORP·Filed 2004·Granted Sep 6, 2005·23 cites·24 claims
- 2479US8192637B2Method and apparatus for imprinting microstructure and stamper thereforWASHIYA RYUTA·Filed 2009·Granted Jun 5, 2012·8 cites·8 claims
- 2578US8158048B2Mold for fine pattern transfer and method for forming resin pattern using sameOHASHI KENYA·Filed 2007·Granted Apr 17, 2012·6 cites·11 claims
- 2677US8562896B2Micropattern transfer method and micropattern transfer deviceISHII SATOSHI·Filed 2010·Granted Oct 22, 2013·3 cites·11 claims
- 2777US8147234B2Imprint apparatus and method for fine structure lithographyOGINO MASAHIKO·Filed 2008·Granted Apr 3, 2012·4 cites·9 claims
- 2877US6933601B2Semiconductor connection substrateHITACHI LTD·Filed 2002·Granted Aug 23, 2005·24 cites·26 claims
- 2977US6348741B1Semiconductor apparatus and a manufacturing method thereofHITACHI LTD·Filed 2000·Granted Feb 19, 2002·25 cites·22 claims
- 3076US8491291B2Pattern transfer method and imprint deviceANDO TAKASHI·Filed 2012·Granted Jul 23, 2013·2 cites·6 claims
- 3176US8133418B2Pattern transfer method and imprint deviceANDO TAKASHI·Filed 2007·Granted Mar 13, 2012·3 cites·12 claims
- 3274US7374417B2Stamper and transfer apparatusHITACHI LTD·Filed 2004·Granted May 20, 2008·21 cites·12 claims
- 3372US8083515B2Fine pattern moldOGINO MASAHIKO·Filed 2008·Granted Dec 27, 2011·2 cites·8 claims
- 3471US6791194B1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 14, 2004·18 cites·18 claims
- 3570US6396145B1Semiconductor device and method for manufacturing the same technical fieldHITACHI LTD·Filed 1998·Granted May 28, 2002·38 cites·26 claims
- 3668US6946723B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2001·Granted Sep 20, 2005·13 cites·13 claims
- 3768US6307269B1Semiconductor device with chip size packageHITACHI LTD·Filed 1998·Granted Oct 23, 2001·32 cites·23 claims
- 3867US6515371B2Semiconductor device with elastic structure and wiringHITACHI LTD·Filed 2001·Granted Feb 4, 2003·13 cites·8 claims
- 3966US12139624B2Ink for inkjet printersHITACHI INDUSTRY EQUIPMENT SYSTEMS CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·6 claims
- 4066US7655457B2Cell culture vessel and cultured cellHITACHI LTD·Filed 2004·Granted Feb 2, 2010·5 cites·10 claims
- 4165US8268209B2Pattern forming method and its moldOGINO MASAHIKO·Filed 2007·Granted Sep 18, 2012·3 cites·7 claims
- 4265US6433440B1Semiconductor device having a porous buffer layer for semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·24 cites·19 claims
- 4364US9211698B2Charge control type ink jet printer and printing methodHITACHI IND EQUIPMENT SYS·Filed 2014·Granted Dec 15, 2015·1 cites·11 claims
- 4464US8113816B2Imprint device and imprint methodTADA YASUHIKO·Filed 2007·Granted Feb 14, 2012·1 cites·21 claims
- 4564US7341441B2Nanoprint equipment and method of making fine structureHITACHI IND CO LTD·Filed 2004·Granted Mar 11, 2008·5 cites·6 claims
- 4663US8366991B2Apparatus for recovering platinum group elementsDOWA METALS & MINING CO LTD·Filed 2010·Granted Feb 5, 2013·1 cites·3 claims
- 4762US8309265B2Electrolyte membrane for fuel cells, its production and fuel cell using the sameMIYAUCHI AKIHIRO·Filed 2004·Granted Nov 13, 2012·8 cites·18 claims
- 4862US2010155989A1Stamper for transferring fine pattern and method for manufacturing thereofISHII SATOSHI·Filed 2009·Application pending·0 cites
- 4961US7294905B2Thin film capacitor and electronic circuit componentHITACHI LTD·Filed 2002·Granted Nov 13, 2007·10 cites·15 claims
- 5061US7202570B2Circuit tape having adhesive film semiconductor device and a method for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Apr 10, 2007·6 cites·23 claims
Showing the top 50 of 107 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →