Inventor · disambiguated record
Marc E. Robinson
Also filed as: ROBINSON MARC · ROBINSON MARC E
18 granted patents·6 pending applications·551 citations·filing 1997–2024
95Inventor score
Files withVERTICAL CIRCUITS INC8INVENSAS CORP4MCELREA SIMON J S4MAXEON SOLAR PTE LTD3CUBIC MEMORY INC2
Top patents by PatentIndex Score
24 records- 0197US8178978B2Support mounted electrically interconnected die assemblyMCELREA SIMON J S·Filed 2009·Granted May 15, 2012·77 cites·38 claims
- 0295US7215018B2Stacked die BGA or LGA component assemblyVERTICAL CIRCUITS INC·Filed 2005·Granted May 8, 2007·80 cites·14 claims
- 0394US7535109B2Die assembly having electrical interconnectVERTICAL CIRCUITS INC·Filed 2007·Granted May 19, 2009·38 cites·54 claims
- 0494US7245021B2Micropede stacked die component assemblyVERTICAL CIRCUITS INC·Filed 2005·Granted Jul 17, 2007·59 cites·12 claims
- 0593US8723332B2Electrically interconnected stacked die assembliesMCELREA SIMON J S·Filed 2008·Granted May 13, 2014·35 cites·38 claims
- 0693US8629543B2Electrically interconnected stacked die assembliesMCELREA SIMON J S·Filed 2010·Granted Jan 14, 2014·19 cites·29 claims
- 0792US6098278AMethod for forming conductive epoxy flip-chip on chipCUBIC MEMORY INC·Filed 1997·Granted Aug 8, 2000·91 cites·14 claims
- 0887US6271598B1Conductive epoxy flip-chip on chipCUBIC MEMORY INC·Filed 1997·Granted Aug 7, 2001·114 cites·2 claims
- 0986US9305862B2Support mounted electrically interconnected die assemblyMCELREA SIMON J S·Filed 2012·Granted Apr 5, 2016·7 cites·17 claims
- 1084US8704379B2Semiconductor die mount by conformal die coatingCRANE SCOTT JAY·Filed 2008·Granted Apr 22, 2014·14 cites·12 claims
- 1183US8357999B2Assembly having stacked die mounted on substrateVERTICAL CIRCUITS ASSIGNMENT FOR THE BENEFIT OF CREDITORS LLC·Filed 2007·Granted Jan 22, 2013·14 cites·92 claims
- 1274US12080815B2Laser assisted metallization process for solar cell stringingMAXEON SOLAR PTE LTD·Filed 2023·Granted Sep 3, 2024·0 cites·8 claims
- 1372US2024429335A1Strings of solar cells having laser assisted metallization conductive contact structures and their methods of manufactureMAXEON SOLAR PTE LTD·Filed 2024·Application pending·0 cites
- 1471US9252116B2Semiconductor die mount by conformal die coatingINVENSAS CORP·Filed 2014·Granted Feb 2, 2016·2 cites·15 claims
- 1567US9824999B2Semiconductor die mount by conformal die coatingINVENSAS CORP·Filed 2015·Granted Nov 21, 2017·1 cites·17 claims
- 1665US11664472B2Laser assisted metallization process for solar cell stringingSUNPOWER CORP·Filed 2019·Granted May 30, 2023·0 cites·8 claims
- 1760US12113142B2Strings of solar cells having laser assisted metallization conductive contact structures and their methods of manufactureMAXEON SOLAR PTE LTD·Filed 2021·Granted Oct 8, 2024·0 cites·2 claims
- 1852US8729690B2Assembly having stacked die mounted on substrateINVENSAS CORP·Filed 2012·Granted May 20, 2014·0 cites·19 claims
- 1949US2016218088A1Support mounted electrically interconnected die assemblyINVENSAS CORP·Filed 2016·Application pending·0 cites
- 2048US2010117224A1SensorVERTICAL CIRCUITS INC·Filed 2009·Application pending·0 cites
- 2147US2010052087A1Image SensorVERTICAL CIRCUITS INC·Filed 2009·Application pending·0 cites
- 2246US2007290377A1Three Dimensional Six Surface Conformal Die CoatingVERTICAL CIRCUITS INC·Filed 2007·Application pending·0 cites
- 2345US2009102038A1Chip scale stacked die packageVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 2440US7705432B2Three dimensional six surface conformal die coatingVERTICAL CIRCUITS INC·Filed 2004·Granted Apr 27, 2010·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →