Inventor · disambiguated record
Manfred Schneegans
Also filed as: SCHNEEGANS MANFRED
51 granted patents·5 pending applications·205 citations·filing 1997–2018
97Inventor score
Top patents by PatentIndex Score
56 records- 0188US9666546B1Multi-layer metal padsINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 30, 2017·6 cites·20 claims
- 0286US7674689B2Method of making an integrated circuit including singulating a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 9, 2010·11 cites·23 claims
- 0384US9929111B2Method of manufacturing a layer structure having partially sealed poresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 27, 2018·4 cites·20 claims
- 0484US6790737B2Method for fabricating thin metal layers from the liquid phaseINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 14, 2004·32 cites·12 claims
- 0583US9620466B1Method of manufacturing an electronic device having a contact pad with partially sealed poresINFINEON TECHNOLOGIES AG·Filed 2015·Granted Apr 11, 2017·4 cites·18 claims
- 0682US8003292B2Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layerINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 23, 2011·4 cites·15 claims
- 0782US6633379B2Apparatus and method for measuring the degradation of a toolSEMICONDUCTOR 300 GMBH & CO KG·Filed 2001·Granted Oct 14, 2003·26 cites·24 claims
- 0878US6752694B2Apparatus for and method of wafer grindingMOTOROLA INC·Filed 2002·Granted Jun 22, 2004·19 cites·18 claims
- 0976US9190322B2Method for producing a copper layer on a semiconductor body using a printing processINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 17, 2015·3 cites·19 claims
- 1073US7351514B2Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layerINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 1, 2008·2 cites·29 claims
- 1170US7911061B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 22, 2011·4 cites·19 claims
- 1268US6958256B2Process for the back-surface grinding of wafersINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 25, 2005·12 cites·17 claims
- 1366US11239188B2Terminal structure of a power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 1, 2022·1 cites·13 claims
- 1466US10090265B2Semiconductor device with metal structure electrically connected to a conductive structureINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 2, 2018·1 cites·38 claims
- 1563US9368436B2Source down semiconductor devices and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jun 14, 2016·1 cites·21 claims
- 1663US7918714B2Methods for treating wafers on assembly carriersINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 5, 2011·1 cites·25 claims
- 1763US7911026B2Chip carrier with reduced interference signal sensitivityQIMONDA AG·Filed 2006·Granted Mar 22, 2011·3 cites·20 claims
- 1863US6919269B2Production method for a semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 19, 2005·9 cites·12 claims
- 1962US9209080B2Semiconductor device comprising a protective structure on a chip backside and method of producing the sameINFINEON TECHNOLOGIES AG·Filed 2012·Granted Dec 8, 2015·1 cites·33 claims
- 2062US7212019B2Probe needle for testing semiconductor chips and method for producing said probe needleINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 1, 2007·11 cites·19 claims
- 2162US5901901ASemiconductor assembly with solder material layer and method for soldering the semiconductor assemlySIEMENS AG·Filed 1997·Granted May 11, 1999·28 cites·3 claims
- 2261US8736054B2Multilayer metallization with stress-reducing interlayerSCHNEEGANS MANFRED·Filed 2011·Granted May 27, 2014·1 cites·27 claims
- 2360US7757390B2Method for production of a semiconductor componentINFINEON TECHOLOGIES AG·Filed 2007·Granted Jul 20, 2010·2 cites·6 claims
- 2458US8264072B2Electronic deviceSCHNEEGANS MANFRED·Filed 2007·Granted Sep 11, 2012·1 cites·16 claims
- 2557US10651140B2Semiconductor device with metal structure electrically connected to a conductive structureINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 12, 2020·0 cites·20 claims
- 2657US8432024B2Integrated circuit including bond wire directly bonded to padSCHNEEGANS MANFRED·Filed 2010·Granted Apr 30, 2013·1 cites·9 claims
- 2754US8415080B2Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layerKROENINGER WERNER·Filed 2011·Granted Apr 9, 2013·0 cites·6 claims
- 2853US10648096B2Electrolyte, method of forming a copper layer and method of forming a chipINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 12, 2020·0 cites·20 claims
- 2952US8993372B2Method for producing a semiconductor componentSCHNEEGANS MANFRED·Filed 2012·Granted Mar 31, 2015·0 cites·22 claims
- 3051US9887170B2Multi-layer metal padsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 6, 2018·0 cites·23 claims
- 3151USRE42980EMethod for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layerKROENINGER WERNER·Filed 2010·Granted Nov 29, 2011·0 cites·29 claims
- 3250US8709876B2Electronic deviceSCHNEEGANS MANFRED·Filed 2012·Granted Apr 29, 2014·0 cites·12 claims
- 3349US11424201B2Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic deviceINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 23, 2022·0 cites·13 claims
- 3449US9911686B2Source down semiconductor devices and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 6, 2018·0 cites·20 claims
- 3549US7755190B2Electronic device including a nickel-palladium alloy layerINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 13, 2010·0 cites·31 claims
- 3648US9449876B2Singulation of semiconductor dies with contact metallization by electrical discharge machiningINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 20, 2016·0 cites·18 claims
- 3748US2014117509A1Metal Deposition with Reduced StressINFINEON TECHNOLOGIES AG·Filed 2012·Application pending·0 cites
- 3847US8816500B2Semiconductor device having peripheral polymer structuresINFINEON TECHNOLOGIES AG·Filed 2012·Granted Aug 26, 2014·0 cites·19 claims
- 3947US8753176B2Device for treating wafers on assembly carriersKROENINGER WERNER·Filed 2011·Granted Jun 17, 2014·0 cites·19 claims
- 4047US8156643B2Semiconductor deviceSCHNEEGANS MANFRED·Filed 2011·Granted Apr 17, 2012·0 cites·20 claims
- 4147US7868452B2Ultrathin semiconductor circuit having contact bumpsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 11, 2011·0 cites·9 claims
- 4245US10340227B2Method for processing a dieINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 2, 2019·0 cites·19 claims
- 4345US9640419B2Carrier system for processing semiconductor substrates, and methods thereofINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 2, 2017·0 cites·21 claims
- 4444US10734352B2Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 4, 2020·0 cites·21 claims
- 4544US9006798B2Semiconductor device including trench transistor cell array and manufacturing methodINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 14, 2015·0 cites·19 claims
- 4644US8735277B2Methods for producing an ultrathin semiconductor circuitMUELLER DIRK·Filed 2010·Granted May 27, 2014·0 cites·30 claims
- 4744US2015235855A1Metal Deposition with Reduced StressINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
- 4843US9780053B2Method of forming a bondpad and bondpadINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 3, 2017·0 cites·15 claims
- 4943US6268659B1Semiconductor body with layer of solder material comprising chromiumINFINEON TECHNOLOGIES AG·Filed 1997·Granted Jul 31, 2001·11 cites·8 claims
- 5042US2014264865A1Semiconductor device and manufacturing method thereofINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →