Inventor · disambiguated record
Makoto Sekine
Also filed as: SEKINE MAKOTO
42 granted patents·6 pending applications·2,246 citations·filing 1984–2024
98Inventor score
Top patents by PatentIndex Score
48 records- 0198US5156881AMethod for forming a film on a substrate by activating a reactive gasTOSHIBA KK·Filed 1991·Granted Oct 20, 1992·376 cites·51 claims
- 0297US5444207APlasma generating device and surface processing device and method for processing wafers in a uniform magnetic fieldTOSHIBA KK·Filed 1993·Granted Aug 22, 1995·132 cites·24 claims
- 0396US6642149B2Plasma processing methodTOKYO ELECTRON LTD·Filed 2002·Granted Nov 4, 2003·92 cites·18 claims
- 0496US5385763AMethod for forming a film on a substrate by activating a reactive gasTOSHIBA KK·Filed 1994·Granted Jan 31, 1995·264 cites·42 claims
- 0595US5897713APlasma generating apparatusTOSHIBA KK·Filed 1996·Granted Apr 27, 1999·161 cites·5 claims
- 0695US4595601AMethod of selectively forming an insulation layerTOSHIBA KK·Filed 1985·Granted Jun 17, 1986·72 cites·20 claims
- 0794US6831367B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Dec 14, 2004·89 cites·18 claims
- 0893US5776557AMethod for forming a film on a substrate by activating a reactive gasTOSHIBA KK·Filed 1996·Granted Jul 7, 1998·110 cites·27 claims
- 0991US6334928B1Semiconductor processing system and method of using the sameTOSHIBA KK·Filed 1999·Granted Jan 1, 2002·97 cites·28 claims
- 1090US8610353B2Plasma generating apparatus, plasma processing apparatus and plasma processing methodITOH HITOSHI·Filed 2011·Granted Dec 17, 2013·7 cites·18 claims
- 1190US6352931B1Manufacturing method of semiconductor devices by using dry etching technologyTOSHIBA KK·Filed 2000·Granted Mar 5, 2002·42 cites·12 claims
- 1289US5660744APlasma generating apparatus and surface processing apparatusTOSHIBA KK·Filed 1995·Granted Aug 26, 1997·65 cites·23 claims
- 1388US4529475ADry etching apparatus and method using reactive gasesTOSHIBA KK·Filed 1984·Granted Jul 16, 1985·68 cites·36 claims
- 1487US5622888AMethod of manufacturing a semiconductor deviceNEC CORP·Filed 1995·Granted Apr 22, 1997·73 cites·10 claims
- 1586US6991878B2Photomask repair method and apparatusTOSHIBA KK·Filed 2002·Granted Jan 31, 2006·23 cites·18 claims
- 1684US4838978ADry etching apparatusTOSHIBA KK·Filed 1987·Granted Jun 13, 1989·70 cites·13 claims
- 1782US6849923B2Semiconductor device and manufacturing method of the sameTOSHIBA KK·Filed 2002·Granted Feb 1, 2005·28 cites·23 claims
- 1882US4642171APhototreating apparatusTOSHIBA KK·Filed 1985·Granted Feb 10, 1987·32 cites·9 claims
- 1980US5717294APlasma process apparatusTOSHIBA KK·Filed 1995·Granted Feb 10, 1998·65 cites·10 claims
- 2078US7138700B2Semiconductor device with guard ring for preventing water from entering circuit region from outsideNEC ELECTRONICS CORP·Filed 2004·Granted Nov 21, 2006·26 cites·18 claims
- 2177US5491339ACharged particle detection device and charged particle radiation apparatusTOSHIBA KK·Filed 1994·Granted Feb 13, 1996·29 cites·22 claims
- 2274US6605542B2Manufacturing method of semiconductor devices by using dry etching technologyTOSHIBA KK·Filed 2001·Granted Aug 12, 2003·13 cites·21 claims
- 2374US5950083AMethod for fabricating CMOS transistor with self-aligned silicide (salicide) structureNEC CORP·Filed 1995·Granted Sep 7, 1999·36 cites·6 claims
- 2474US2024240324A1Carbon hard mask, film forming apparatus, and film forming methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2572US5221450AElectrostatic chucking methodTOSHIBA KK·Filed 1991·Granted Jun 22, 1993·49 cites·4 claims
- 2671US5937300ASemiconductor apparatus and fabrication method thereofNEC CORP·Filed 1997·Granted Aug 10, 1999·40 cites·11 claims
- 2770US5661052AMethod of fabricating semiconductor device having low-resistance gate electrode and diffusion layersNEC CORP·Filed 1996·Granted Aug 26, 1997·32 cites·18 claims
- 2869US5591486AMethod for forming a film on a substrate by activating a reactive gasTOSHIBA KK·Filed 1995·Granted Jan 7, 1997·25 cites·1 claims
- 2966US7202168B2Method of producing semiconductor deviceTOSHIBA KK·Filed 2005·Granted Apr 10, 2007·3 cites·20 claims
- 3066US4878995AMethod of dry etching and apparatus for use in such methodTOSHIBA KK·Filed 1988·Granted Nov 7, 1989·30 cites·34 claims
- 3165US4668337ADry-etching method and apparatus thereforTOSHIBA KK·Filed 1985·Granted May 26, 1987·29 cites·25 claims
- 3264US4786361ADry etching processTOSHIBA KK·Filed 1987·Granted Nov 22, 1988·28 cites·16 claims
- 3361US11993849B2Carbon hard mask, film forming apparatus, and film forming methodTOKYO ELECTRON LTD·Filed 2019·Granted May 28, 2024·0 cites·3 claims
- 3459US7169697B2Semiconductor device and manufacturing method of the sameTOSHIBA KK·Filed 2004·Granted Jan 30, 2007·7 cites·4 claims
- 3553US5776829AMethod for forming multilevel interconnections in a semiconductor deviceNEC CORP·Filed 1995·Granted Jul 7, 1998·20 cites·4 claims
- 3644US2015056381A1Method for forming conductive filmUNIV NAGOYA NAT UNIV CORP·Filed 2013·Application pending·0 cites
- 3743US4954406AElectrophotographic plate including an undercoating layer having a smooth surfaceHITACHI CHEMICAL CO LTD·Filed 1988·Granted Sep 4, 1990·6 cites·7 claims
- 3842US11118638B2Reverse input lock clutchTOK INC·Filed 2017·Granted Sep 14, 2021·0 cites·6 claims
- 3942US2014008326A1Plasma generation device, plasma processing apparatus and plasma processing methodUNIV NAGOYA NAT UNIV CORP·Filed 2013·Application pending·0 cites
- 4042US2003224611A1Manufacturing method of semiconductor devices by using dry etching technologyTOSHIBA KK·Filed 2003·Application pending·0 cites
- 4141US11131134B2Hinge arm damper mechanismTOK INC·Filed 2018·Granted Sep 28, 2021·0 cites·5 claims
- 4239US9852892B1Microwave supply apparatus, plasma processing apparatus, and plasma processing methodTOKYO ELECTRON LTD·Filed 2017·Granted Dec 26, 2017·0 cites·11 claims
- 4339US2006017162A1Semiconductor device and manufacturing method of the sameSETA SHOJI·Filed 2005·Application pending·0 cites
- 4439US2005045090A1Apparatus for laser beam machining, machining mask, method for laser beam machining, method for manufacturing a semiconductor device and semiconductor deviceFiled 2004·Application pending·0 cites
- 4538US11339242B2Method for manufacturing semiconductor substrate having group-III nitride compound layerNISSAN CHEMICAL CORP·Filed 2017·Granted May 24, 2022·0 cites·7 claims
- 4633US5112645APhototreating method and apparatus thereforTOSHIBA KK·Filed 1990·Granted May 12, 1992·4 cites·5 claims
- 4732US11035809B2Thermal diffusion factor measurement device, thermal diffusion factor measurement method and programBETEL CO LTD·Filed 2017·Granted Jun 15, 2021·0 cites·8 claims
- 4832US4844774APhototreating method and apparatus thereforTOSHIBA KK·Filed 1988·Granted Jul 4, 1989·3 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →