Inventor · disambiguated record
Masaya Shimamura
Also filed as: SHIMAMURA MASAYA
16 granted patents·6 pending applications·93 citations·filing 2013–2019
92Inventor score
Files withTAIYO YUDEN KK22
Top patents by PatentIndex Score
22 records- 0193US8897019B1Circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Nov 25, 2014·22 cites·3 claims
- 0292US9055682B2Circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Jun 9, 2015·18 cites·3 claims
- 0390US10665936B2Wireless module and method for manufacturing wireless moduleTAIYO YUDEN KK·Filed 2017·Granted May 26, 2020·7 cites·11 claims
- 0487US8890309B1Circuit module and method of producing circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Nov 18, 2014·8 cites·3 claims
- 0584US10529668B2Method of manufacturing electronic component moduleTAIYO YUDEN KK·Filed 2018·Granted Jan 7, 2020·4 cites·5 claims
- 0684US9456488B2Circuit module and method of producing circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Sep 27, 2016·7 cites·5 claims
- 0783US10714822B2Wireless module and method for manufacturing wireless moduleTAIYO YUDEN KK·Filed 2017·Granted Jul 14, 2020·4 cites·4 claims
- 0882US9101050B2Circuit module having electrical shieldTAIYO YUDEN KK·Filed 2013·Granted Aug 4, 2015·6 cites·1 claims
- 0982US9101044B2Circuit module and method of producing the sameTAIYO YUDEN KK·Filed 2013·Granted Aug 4, 2015·6 cites·11 claims
- 1078US9807916B2Circuit module and method of producing the sameTAIYO YUDEN KK·Filed 2013·Granted Oct 31, 2017·5 cites·7 claims
- 1174US10756024B2Electronic component module and method of manufacturing the sameTAIYO YUDEN KK·Filed 2018·Granted Aug 25, 2020·2 cites·18 claims
- 1272US9455209B2Circuit module and production method thereforTAIYO YUDEN KK·Filed 2014·Granted Sep 27, 2016·3 cites·9 claims
- 1370US10490512B2Method of making plural electronic component modulesTAIYO YUDEN KK·Filed 2019·Granted Nov 26, 2019·1 cites·4 claims
- 1454US9018039B2Circuit module and method of producing circuit moduleTAIYO YUDEN KK·Filed 2014·Granted Apr 28, 2015·0 cites·2 claims
- 1550US2018286816A1Electronic component moduleTAIYO YUDEN KK·Filed 2018·Application pending·0 cites
- 1643US2015062835A1Circuit moduleTAIYO YUDEN KK·Filed 2013·Application pending·0 cites
- 1743US2015043172A1Circuit module and method of producing circuit moduleTAIYO YUDEN KK·Filed 2013·Application pending·0 cites
- 1843US2015016066A1Circuit module and method of producing the sameTAIYO YUDEN KK·Filed 2014·Application pending·0 cites
- 1942US2015043189A1Circuit module and method of producing the sameTAIYO YUDEN KK·Filed 2013·Application pending·0 cites
- 2041US2013271928A1Circuit module and method of manufacturing the sameTAIYO YUDEN KK·Filed 2013·Application pending·0 cites
- 2138US10868364B2Wireless module and method for manufacturing the sameTAIYO YUDEN KK·Filed 2017·Granted Dec 15, 2020·0 cites·6 claims
- 2238US9560740B2Circuit module and method of manufacturing sameTAIYO YUDEN KK·Filed 2015·Granted Jan 31, 2017·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →