Electronic component module

Abstract

To provide an electronic component module capable of forming a shielding film in a state of an assembly substrate and enhancing productivity. An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and the substrate, the sealing portion having an upper surface and a side surface, the upper surface and the side surface forming an edge portion; a contact portion provided to the substrate, the contact portion being configured to be electrically connected with the conductive pattern, the contact portion having a vertical surface continuous with the side surface of the sealing portion and a horizontal surface continuous with the vertical surface; and a shielding film covering the upper surface and the side surface of the sealing portion and the contact portion.

What is claimed is: 
     
         1 . An electronic component module comprising:
 a substrate including a conductive pattern;   an electronic component provided to the substrate;   a sealing portion covering the electronic component and the substrate, the sealing portion having an upper surface and a side surface, the upper surface and the side surface forming an edge portion;   a contact portion provided to the substrate, the contact portion being configured to be electrically connected with the conductive pattern, the contact portion having a vertical surface continuous with the side surface of the sealing portion and a horizontal surface continuous with the vertical surface; and   a shielding film covering the upper surface and the side surface of the sealing portion and the contact portion.   
     
     
         2 . An electronic component module according to  claim 1 , wherein
 the substrate is provided with the conductive pattern, the substrate including a wireless region, where the electronic component is disposed, and an antenna region, where a wiring pattern serving as an antenna is disposed, and   the electronic component is configured to be electrically connected with the conductive pattern, and is a wireless circuit component provided in the wireless region.   
     
     
         3 . An electronic component module according to  claim 1 , wherein
 the contact portion is configured to be electrically connected with the conductive pattern, and   the contact portion includes at least one of
 an electrode provided to a front layer or an inner layer of the substrate, 
 a via provided so as to connect between the electrode and a layer thereabove or a layer therebelow, or between the layers, or 
 a through hole provided to an upper layer or a lower layer with respect to the electrode. 
   
     
     
         4 . An electronic component module according to  claim 1 , wherein the electrode of the contact portion includes a solid ground. 
     
     
         5 . An electronic component module according to  claim 3 , wherein
 the via includes a plurality of vias and the through hole includes a plurality of through holes, and   the plurality of vias or through holes is provided in a row or provided at random, in a portion corresponding to the side surface of the sealing portion.   
     
     
         6 . An electronic component module according to  claim 1 , wherein the contact portion includes a curved surface between the vertical surface and the horizontal surface. 
     
     
         7 . An electronic component module according to  claim 4 , wherein
 t 1 >t 3 , and   t 2 >t 3  or t 4 >t 3 ,   where t 1  is a film thickness of the shielding film in the upper surface of the sealing portion, t 2  is a film thickness of the shielding film in the horizontal surface of the contact portion, t 3  is a film thickness of the shielding film in the side surface of the sealing portion, and t 4  is a film thickness of the shielding film in the curved surface of the contact portion.   
     
     
         8 . An electronic component module according to  claim 1  further comprising:
 a removal portion formed by cutting off the edge portion formed by the upper surface and the side surface of the sealing portion, wherein 
 the removal portion is a region where a conductive material scattered in vacuum atmosphere having a pressure lower than atmospheric pressure is allowed to pass therethrough, so as to coat the contact portion with a shielding film. 
 
     
     
         9 . An electronic component module according to  claim 8 , wherein the removal portion is formed above the electronic component. 
     
     
         10 . An electronic component module according to  claim 1 , wherein
 the contact portion is provided on one side of the substrate where the contact portion is positioned, and   the sealing portion on the one side and the substrate underlying the sealing portion on the one side are ground to be exposed by a dicing apparatus.   
     
     
         11 . An electronic component module according to  claim 8 , wherein
 the contact portion is provided on one side of the substrate where the contact portion is positioned, and   the removal portion is provided on another side opposed to the one side.   
     
     
         12 . An electronic component module according to  claim 11 , wherein
 the shielding film includes a first film made of Cu as a main material and a SUS film coated over the first film, the shielding film constituted by a matter scattered under low vacuum.