Inventor · disambiguated record
Masafumi Suzuhara
Also filed as: SUZUHARA MASAFUMI
6 granted patents·0 citations·filing 2013–2022
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0170US11887915B2Semiconductor device having outer terminal portions with conductive layer on outer end surfaces and a method of manufacturing a semiconductor deviceAMKOR TECH JAPAN INC·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 0264US11322431B2Semiconductor device having outer terminal portions with conductive layer on outer end surfaces and method of manufacturing a semiconductor deviceJ DEVICES CORP·Filed 2020·Granted May 3, 2022·0 cites·16 claims
- 0354US10559523B2Semiconductor package and a method for manufacturing a semiconductor deviceJ DEVICES CORP·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
- 0451US9087709B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jul 21, 2015·0 cites·20 claims
- 0550US10062638B2Semiconductor package and a method for manufacturing a semiconductor deviceJ DEVICES CORP·Filed 2017·Granted Aug 28, 2018·0 cites·3 claims
- 0650US8922001B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 30, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →