Inventor · disambiguated record
Masamoto Tago
Also filed as: TAGO MASAMOTO
29 granted patents·3 pending applications·1,035 citations·filing 1994–2012
97Inventor score
Top patents by PatentIndex Score
32 records- 0198US5508561AApparatus for forming a double-bump structure used for flip-chip mountingNEC CORP·Filed 1994·Granted Apr 16, 1996·313 cites·20 claims
- 0297US6844619B2Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the sameNEC CORP·Filed 2001·Granted Jan 18, 2005·151 cites·12 claims
- 0396US7449406B2Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the sameNEC CORP·Filed 2006·Granted Nov 11, 2008·34 cites·12 claims
- 0496US7268438B2Semiconductor element including a wet prevention filmNEC CORP·Filed 2005·Granted Sep 11, 2007·40 cites·8 claims
- 0595US5633204AMethod and apparatus for forming bump structure used for flip-chip mounting, the bump structure and the flip-chipNEC CORP·Filed 1995·Granted May 27, 1997·181 cites·5 claims
- 0694US7135770B2Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projectionNEC CORP·Filed 2003·Granted Nov 14, 2006·71 cites·13 claims
- 0792US7749888B2Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the sameNEC CORP·Filed 2008·Granted Jul 6, 2010·17 cites·19 claims
- 0891US7611041B2Semiconductor device, manufacturing method and apparatus for the sameNEC CORP·Filed 2007·Granted Nov 3, 2009·19 cites·17 claims
- 0990US7793818B2Semiconductor device, manufacturing method and apparatus for the sameNEC CORP·Filed 2009·Granted Sep 14, 2010·15 cites·16 claims
- 1090US7282432B2Semiconductor device, manufacturing method and apparatus for the sameNEC CORP·Filed 2005·Granted Oct 16, 2007·16 cites·20 claims
- 1184US6653731B2Semiconductor device and method for fabricating sameNEC CORP·Filed 2001·Granted Nov 25, 2003·38 cites·5 claims
- 1283US6969915B2Semiconductor device, manufacturing method and apparatus for the sameNEC CORP·Filed 2002·Granted Nov 29, 2005·26 cites·69 claims
- 1381US7218005B2Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the sameNEC CORP·Filed 2004·Granted May 15, 2007·25 cites·10 claims
- 1477US8513810B2Semiconductor device and method of manufacturing sameTAGO MASAMOTO·Filed 2009·Granted Aug 20, 2013·8 cites·15 claims
- 1577US6583514B2Semiconductor device with a binary alloy bonding layerNEC CORP·Filed 2001·Granted Jun 24, 2003·23 cites·15 claims
- 1667US7297575B2System semiconductor device and method of manufacturing the sameNEC CORP·Filed 2005·Granted Nov 20, 2007·3 cites·15 claims
- 1761US6555416B2Chip size package semiconductor device and method of forming the sameNEC CORP·Filed 2001·Granted Apr 29, 2003·8 cites·7 claims
- 1860US7525189B2Semiconductor device, wiring board, and manufacturing method thereofNEC CORP·Filed 2005·Granted Apr 28, 2009·2 cites·9 claims
- 1958US7728439B2Semiconductor device, wiring substrate, and method for manufacturing wiring substrateNEC CORP·Filed 2003·Granted Jun 1, 2010·8 cites·18 claims
- 2057US7692287B2Semiconductor device and wiring boardNEC CORP·Filed 2005·Granted Apr 6, 2010·1 cites·23 claims
- 2157US6344696B2Chip size package semiconductor device and method of forming the sameNEC CORP·Filed 1998·Granted Feb 5, 2002·19 cites·16 claims
- 2256US8916976B2Semiconductor device and method of manufacturing the sameTAGO MASAMOTO·Filed 2008·Granted Dec 23, 2014·1 cites·5 claims
- 2355US6803253B2Method for laminating and mounting semiconductor chipNEC CORP·Filed 2001·Granted Oct 12, 2004·6 cites·17 claims
- 2454US6882542B2Electronic apparatusNEC CORP·Filed 2003·Granted Apr 19, 2005·6 cites·10 claims
- 2552US7098538B1System semiconductor device and method of manufacturing the sameNEC CORP·Filed 2000·Granted Aug 29, 2006·4 cites·6 claims
- 2646US9125311B2Hollow sealing structureNEC CORP·Filed 2012·Granted Sep 1, 2015·0 cites·5 claims
- 2741US8536890B2Semiconductor inspecting device and semiconductor inspecting methodKAMEDA YOSHIO·Filed 2009·Granted Sep 17, 2013·0 cites·21 claims
- 2840US8570056B2Semiconductor inspection apparatus, semiconductor wafer positioning method, and semiconductor wafer inspection methodKAMEDA YOSHIO·Filed 2009·Granted Oct 29, 2013·0 cites·16 claims
- 2939US8791544B2Semiconductor device, mounted substrate to be used in semiconductor device, and manufacturing method of mounted substrateTAGO MASAMOTO·Filed 2010·Granted Jul 29, 2014·0 cites·18 claims
- 3039US2008217767A1Stacked-Chip Semiconductor DeviceTAGO MASAMOTO·Filed 2005·Application pending·0 cites
- 3139US2010194423A1Apparatus and method for testing semiconductor and semiconductor device to be testedTAGO MASAMOTO·Filed 2008·Application pending·0 cites
- 3236US2012018726A1Semiconductor wafer and method for manufacturing semiconductor deviceNAKAGAWA YOSHIHIRO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →