Inventor · disambiguated record
Masao Tokunari
Also filed as: TOKUNARI MASAO
40 granted patents·1 pending application·157 citations·filing 2013–2021
97Inventor score
Top patents by PatentIndex Score
41 records- 0197US10775573B1Embedding mirror with metal particle coatingIBM·Filed 2019·Granted Sep 15, 2020·32 cites·20 claims
- 0295US10018781B1Fluid control structureIBM·Filed 2017·Granted Jul 10, 2018·16 cites·16 claims
- 0395US9341797B2Optical module and method for manufacturing optical moduleIBM·Filed 2014·Granted May 17, 2016·17 cites·20 claims
- 0492US10613282B2Fluid control structureIBM·Filed 2018·Granted Apr 7, 2020·8 cites·15 claims
- 0592US9989713B1Fluid control structureIBM·Filed 2017·Granted Jun 5, 2018·8 cites·10 claims
- 0691US11460647B2Lateral mounting of optoelectronic chips on organic substrateIBM·Filed 2020·Granted Oct 4, 2022·2 cites·20 claims
- 0791US10598874B2Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bumpIBM·Filed 2017·Granted Mar 24, 2020·6 cites·15 claims
- 0891US9354408B2Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguideIBM·Filed 2013·Granted May 31, 2016·12 cites·5 claims
- 0988US10222555B2Integrated optoelectronic chip and lens arrayIBM·Filed 2017·Granted Mar 5, 2019·4 cites·10 claims
- 1088US9372305B2Alignment of single-mode polymer waveguide (PWG) array and silicon waveguide (SIWG) array of providing adiabatic couplingIBM·Filed 2013·Granted Jun 21, 2016·7 cites·12 claims
- 1186US10043787B2Optoelectronic chip embedded organic substrateIBM·Filed 2017·Granted Aug 7, 2018·4 cites·19 claims
- 1286US9658411B2Alignment of single-mode polymer waveguide (PWG) array and silicon waveguide (SiWG) array of providing adiabatic couplingIBM·Filed 2016·Granted May 23, 2017·4 cites·6 claims
- 1385US9289921B2Method of forming single-mode polymer waveguide array connectorIBM·Filed 2015·Granted Mar 22, 2016·4 cites·5 claims
- 1481US11112570B2Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bumpIBM·Filed 2020·Granted Sep 7, 2021·1 cites·20 claims
- 1581US9389366B2Optical modules for wavelength multiplexingIBM·Filed 2014·Granted Jul 12, 2016·4 cites·12 claims
- 1681US8971678B2Spacer resin pattern helping to reduce optical coupling loss in optical waveguide for light-emitting element or light-receiving element on semiconductorIBM·Filed 2013·Granted Mar 3, 2015·5 cites·18 claims
- 1780US10371907B2Fluid control structureIBM·Filed 2017·Granted Aug 6, 2019·2 cites·20 claims
- 1880US9023256B2Method of forming single-mode polymer waveguide array connectorIBM·Filed 2013·Granted May 5, 2015·4 cites·9 claims
- 1979US10418351B2Optoelectronic chip embedded organic substrateIBM·Filed 2018·Granted Sep 17, 2019·2 cites·18 claims
- 2079US9952392B2Optical module and method for manufacturing optical moduleIBM·Filed 2017·Granted Apr 24, 2018·2 cites·12 claims
- 2178US10914901B2Lateral mounting of optoelectronic chips on organic substrateIBM·Filed 2017·Granted Feb 9, 2021·2 cites·13 claims
- 2278US9772462B2Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguideIBM·Filed 2016·Granted Sep 26, 2017·2 cites·10 claims
- 2378US9720190B2Optical module and method for manufacturing optical moduleIBM·Filed 2016·Granted Aug 1, 2017·2 cites·12 claims
- 2476US10365431B2Optical interconnect structureIBM·Filed 2016·Granted Jul 30, 2019·2 cites·13 claims
- 2576US9721812B2Optical device with precoated underfillIBM·Filed 2015·Granted Aug 1, 2017·2 cites·16 claims
- 2671US10690867B1Optical device with adhesive connection of recess or side protrusionIBM·Filed 2019·Granted Jun 23, 2020·1 cites·25 claims
- 2771US10168494B2Off-axis micro-mirror arrays for optical coupling in polymer waveguidesIBM·Filed 2016·Granted Jan 1, 2019·1 cites·2 claims
- 2868US11181704B2Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bumpIBM·Filed 2020·Granted Nov 23, 2021·0 cites·20 claims
- 2968US10840428B2Scalable quantum devices with vertical coaxial resonatorsIBM·Filed 2019·Granted Nov 17, 2020·1 cites·20 claims
- 3064US12436444B2Electro-optomechanical quantum transductionIBM·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
- 3164US10948659B2Integrated optoelectronic chip and lens arrayIBM·Filed 2019·Granted Mar 16, 2021·0 cites·19 claims
- 3263US10782480B2Integrated optoelectronic chip and lens arrayIBM·Filed 2019·Granted Sep 22, 2020·0 cites·8 claims
- 3362US10656352B2Off-axis micro-mirror arrays for optical coupling in polymer waveguidesIBM·Filed 2018·Granted May 19, 2020·0 cites·20 claims
- 3462US10598872B2Off-axis micro-mirror arrays for optical coupling in polymer waveguidesIBM·Filed 2018·Granted Mar 24, 2020·0 cites·19 claims
- 3560US10310187B2Integrated optoelectronic chip and lens arrayIBM·Filed 2018·Granted Jun 4, 2019·0 cites·4 claims
- 3656US9077450B2Wavelength division multiplexing with multi-core fiberIBM·Filed 2013·Granted Jul 7, 2015·0 cites·20 claims
- 3754US11914204B2Optical connector device with lidIBM·Filed 2020·Granted Feb 27, 2024·0 cites·11 claims
- 3854US9927576B2Optical modules for wavelength multiplexingIBM·Filed 2016·Granted Mar 27, 2018·0 cites·11 claims
- 3954US9470846B2Wavelength division multiplexing with multi-core fiberGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 18, 2016·0 cites·20 claims
- 4054US9341785B2Wavelength division multiplexing with multi-core fiberGLOBALFOUNDRIES INC·Filed 2013·Granted May 17, 2016·0 cites·20 claims
- 4147US2017146741A1Optical device with precoated underfillIBM·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Masao Tokunari files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →