Inventor · disambiguated record
Maju Tomura
Also filed as: TOMURA MAJU
49 granted patents·44 pending applications·201 citations·filing 2014–2025
97Inventor score
Files withTOKYO ELECTRON LTD93
Top patents by PatentIndex Score
93 records- 0198US9972503B2Etching methodTOKYO ELECTRON LTD·Filed 2017·Granted May 15, 2018·40 cites·16 claims
- 0298US9837285B2Etching methodTOKYO ELECTRON LTD·Filed 2015·Granted Dec 5, 2017·40 cites·11 claims
- 0397US10090191B2Selective plasma etching method of a first region containing a silicon atom and an oxygen atomTOKYO ELECTRON LTD·Filed 2015·Granted Oct 2, 2018·39 cites·20 claims
- 0496US11551937B2Etching methodTOKYO ELECTRON LTD·Filed 2022·Granted Jan 10, 2023·2 cites·36 claims
- 0595US11615964B2Etching methodTOKYO ELECTRON LTD·Filed 2022·Granted Mar 28, 2023·2 cites·30 claims
- 0695US9922806B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2016·Granted Mar 20, 2018·44 cites·21 claims
- 0794US11101138B2Etching methodTOKYO ELECTRON LTD·Filed 2020·Granted Aug 24, 2021·3 cites·21 claims
- 0889US11355352B2Plasma etching method and plasma etching apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Jun 7, 2022·2 cites·11 claims
- 0988US12400835B2Plasma processing method and plasma processing systemTOKYO ELECTRON LTD·Filed 2022·Granted Aug 26, 2025·1 cites·19 claims
- 1088US11450537B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Sep 20, 2022·2 cites·22 claims
- 1185US10163653B2Plasma etching method and plasma etching apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Dec 25, 2018·5 cites·8 claims
- 1284US11361976B2Substrate processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Jun 14, 2022·1 cites·20 claims
- 1384US2025046615A1Etching methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1483US11355350B2Etching method, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2020·Granted Jun 7, 2022·1 cites·20 claims
- 1582US12142484B2Etching methodTOKYO ELECTRON LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 1682US12112954B2Etching method, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2021·Granted Oct 8, 2024·1 cites·20 claims
- 1782US11810791B2Etching method, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2021·Granted Nov 7, 2023·1 cites·19 claims
- 1882US11798793B2Substrate processing method, component processing method, and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Oct 24, 2023·1 cites·17 claims
- 1982US10707091B2Plasma etching method and plasma etching apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Jul 7, 2020·2 cites·8 claims
- 2082US9390935B2Etching methodTOKYO ELECTRON LTD·Filed 2014·Granted Jul 12, 2016·5 cites·8 claims
- 2181US2025364260A1Plasma processing method and plasma processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2280US10600654B2Etching process methodTOKYO ELECTRON LTD·Filed 2017·Granted Mar 24, 2020·3 cites·7 claims
- 2380US9299579B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2015·Granted Mar 29, 2016·3 cites·8 claims
- 2478US2025349552A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2577US12062522B2Plasma etching method and plasma etching apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Aug 13, 2024·0 cites·12 claims
- 2675US10586710B2Etching methodTOKYO ELECTRON LTD·Filed 2018·Granted Mar 10, 2020·1 cites·17 claims
- 2774US10692729B2Etching process methodTOKYO ELECTRON LTD·Filed 2017·Granted Jun 23, 2020·2 cites·15 claims
- 2873US12387936B2Plasma processing method and plasma processing systemTOKYO ELECTRON LTD·Filed 2022·Granted Aug 12, 2025·0 cites·21 claims
- 2973US11961746B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 3073US2025022706A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3173US2022285169A1Substrate processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 3273US2025323055A1Etching methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 3372US11342194B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted May 24, 2022·0 cites·39 claims
- 3472US2022246443A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 3570US12512325B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2023·Granted Dec 30, 2025·0 cites·16 claims
- 3670US12387941B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Aug 12, 2025·0 cites·19 claims
- 3769US2023395390A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 3869US2023207343A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 3968US12051570B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jul 30, 2024·0 cites·19 claims
- 4067US12412749B2Etching method and plasma processing systemTOKYO ELECTRON LTD·Filed 2023·Granted Sep 9, 2025·0 cites·19 claims
- 4165US11600501B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Mar 7, 2023·0 cites·20 claims
- 4265US11127600B2Etching methodTOKYO ELECTRON LTD·Filed 2020·Granted Sep 21, 2021·0 cites·19 claims
- 4365US2022301881A1Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 4465US2023268191A1Etching methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 4564US11380555B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Jul 5, 2022·0 cites·19 claims
- 4664US2024006168A1Substrate processing method, component processing method, and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 4763US2021398819A1Etching methodTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 4862US12341020B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Jun 24, 2025·0 cites·22 claims
- 4962US2024153744A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 5061US2022165578A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
Showing the top 50 of 93 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →