Inventor · disambiguated record
Masaki Tsujimoto
Also filed as: TSUJIMOTO MASAKI
26 granted patents·10 pending applications·421 citations·filing 1997–2025
96Inventor score
Files withLINTEC CORP15ASAHI KASEI MICRODEVICES CORP10JST MFG CO LTD9TOCHI AKIHIRO1TSUJIMOTO MASAKI1
Top patents by PatentIndex Score
36 records- 0191US7798195B2Suction unitLINTEC CORP·Filed 2005·Granted Sep 21, 2010·20 cites·5 claims
- 0290US6176966B1Method of die bonding electronic component and die bonding apparatus thereofLINTEC CORP·Filed 1998·Granted Jan 23, 2001·110 cites·14 claims
- 0387US7611600B2Sticking apparatus and sticking methodLINTEC CORP·Filed 2005·Granted Nov 3, 2009·13 cites·12 claims
- 0487US6689245B2Die bonding sheet sticking apparatus and method of sticking die bonding sheetLINTEC CORP·Filed 2002·Granted Feb 10, 2004·45 cites·13 claims
- 0583US6238515B1Wafer transfer apparatusLINTEC CORP·Filed 1999·Granted May 29, 2001·68 cites·10 claims
- 0680US5961768AApparatus for applying adhesive sheetsLINTEC CORP·Filed 1997·Granted Oct 5, 1999·61 cites·20 claims
- 0775US8243456B2Component joining structure, IC card, and connectorTOCHI AKIHIRO·Filed 2010·Granted Aug 14, 2012·6 cites·13 claims
- 0873US12292460B2Current sensorASAHI KASEI MICRODEVICES CORP·Filed 2024·Granted May 6, 2025·0 cites·4 claims
- 0973US12153071B2Current sensorASAHI KASEI MICRODEVICES CORP·Filed 2023·Granted Nov 26, 2024·0 cites·13 claims
- 1073US7846289B2Sheet peeling apparatus and sheet peeling methodLINTEC CORP·Filed 2005·Granted Dec 7, 2010·7 cites·8 claims
- 1172US6149758ASheet removing apparatus and methodLINTEC CORP·Filed 1998·Granted Nov 21, 2000·39 cites·14 claims
- 1272US2025306061A1Current sensor and current measurement deviceASAHI KASEI MICRODEVICES CORP·Filed 2025·Application pending·0 cites
- 1371US12044707B2Current sensorASAHI KASEI MICRODEVICES CORP·Filed 2023·Granted Jul 23, 2024·0 cites·7 claims
- 1471US11867728B1Current sensorASAHI KASEI MICRODEVICES CORP·Filed 2023·Granted Jan 9, 2024·0 cites·14 claims
- 1570US11971432B2Current sensorASAHI KASEI MICRODEVICES CORP·Filed 2023·Granted Apr 30, 2024·0 cites·7 claims
- 1670US7972170B2Card connectorJST MFG CO LTD·Filed 2009·Granted Jul 5, 2011·5 cites·7 claims
- 1770US7819679B2Card connectorJST MFG CO LTD·Filed 2009·Granted Oct 26, 2010·4 cites·2 claims
- 1866US2025237678A1Current sensorASAHI KASEI MICRODEVICES CORP·Filed 2025·Application pending·0 cites
- 1965US6767803B2Method for peeling protective sheetLINTEC CORP·Filed 2002·Granted Jul 27, 2004·8 cites·18 claims
- 2062US2025110155A1Current sensorASAHI KASEI MICRODEVICES CORP·Filed 2024·Application pending·0 cites
- 2162US2025164530A1Current sensorASAHI KASEI MICRODEVICES CORP·Filed 2024·Application pending·0 cites
- 2260US8345430B2IC cardJST MFG CO LTD·Filed 2010·Granted Jan 1, 2013·1 cites·6 claims
- 2360US6616799B2Sheet removing apparatus and methodLINTEC CORP·Filed 2001·Granted Sep 9, 2003·9 cites·12 claims
- 2460US2025183589A1Floating connectorJST MFG CO LTD·Filed 2024·Application pending·0 cites
- 2559US12050236B2Current sensorASAHI KASEI MICRODEVICES CORP·Filed 2023·Granted Jul 30, 2024·0 cites·5 claims
- 2659US2024213714A1Electrical connectorJST MFG CO LTD·Filed 2023·Application pending·0 cites
- 2758US7686916B2Sheet peeling apparatus and peeling methodLINTEC CORP·Filed 2004·Granted Mar 30, 2010·6 cites·9 claims
- 2858US6872229B2Apparatus for peeling protective sheetLINTEC CORP·Filed 2003·Granted Mar 29, 2005·5 cites·20 claims
- 2957US8196632B2Mounting apparatus and mounting methodTSUJIMOTO MASAKI·Filed 2004·Granted Jun 12, 2012·8 cites·8 claims
- 3057US2024322464A1Electrical connectorJST MFG CO LTD·Filed 2024·Application pending·0 cites
- 3152US7896660B2IC cardJST MFG CO LTD·Filed 2010·Granted Mar 1, 2011·2 cites·4 claims
- 3250US7806701B2Electronic card having a countermeasure against static electricityJST MFG CO LTD·Filed 2009·Granted Oct 5, 2010·3 cites·8 claims
- 3349US8968013B2Modular jackJST MFG CO LTD·Filed 2013·Granted Mar 3, 2015·1 cites·10 claims
- 3441US2010096090A1Sticking apparatusLINTEC CORP·Filed 2006·Application pending·0 cites
- 3540US2008011412A1Sheet Peeling Apparatus and Peeling MethodLINTEC CORP·Filed 2005·Application pending·0 cites
- 3637US2003088959A1Wafer transfer apparatusLINTEC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →