Inventor · disambiguated record
Masafumi Urakawa
Also filed as: URAKAWA MASAFUMI
13 granted patents·5 pending applications·680 citations·filing 2004–2025
91Inventor score
Top patents by PatentIndex Score
18 records- 0197US10707053B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2017·Granted Jul 7, 2020·40 cites·5 claims
- 0297US9870898B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2016·Granted Jan 16, 2018·48 cites·4 claims
- 0396US9865471B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2016·Granted Jan 9, 2018·43 cites·11 claims
- 0495US8038835B2Processing device, electrode, electrode plate, and processing methodTOKYO ELECTRON LTD·Filed 2010·Granted Oct 18, 2011·529 cites·4 claims
- 0579US11037763B2Member and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Jun 15, 2021·3 cites·12 claims
- 0677US8183161B2Method and system for dry etching a hafnium containing materialFERNANDEZ LUIS ISIDRO·Filed 2006·Granted May 22, 2012·9 cites·20 claims
- 0773US7846645B2Method and system for reducing line edge roughness during pattern etchingTOKYO ELECTRON LTD·Filed 2007·Granted Dec 7, 2010·4 cites·20 claims
- 0867US7743731B2Reduced contaminant gas injection system and method of usingTOKYO ELECTRON LTD·Filed 2006·Granted Jun 29, 2010·3 cites·16 claims
- 0963US9653316B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2014·Granted May 16, 2017·1 cites·14 claims
- 1059US2024162047A1Etching method, method for manufacturing semiconductor device, etching program, and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1158US12211678B2Recipe updating methodTOKYO ELECTRON LTD·Filed 2021·Granted Jan 28, 2025·0 cites·10 claims
- 1250US9257301B2Method of etching silicon oxide filmTOKYO ELECTRON LTD·Filed 2014·Granted Feb 9, 2016·0 cites·14 claims
- 1350US2023386798A1Substrate processing apparatus and method for aligning ring memberTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1450US2009151870A1Silicon carbide focus ring for plasma etching systemTOKYO ELECTRON LTD·Filed 2007·Application pending·0 cites
- 1549US9530657B2Method of processing substrate and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Dec 27, 2016·0 cites·8 claims
- 1644US9224616B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Dec 29, 2015·0 cites·5 claims
- 1744US2025149300A1Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1842US2005092435A1Processing device, electrode, electrode plate, and processing methodTOKYO ELECTRON LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →