Inventor · disambiguated record
Masaki Utsumi
Also filed as: UTSUMI MASAKI
17 granted patents·10 pending applications·711 citations·filing 1997–2016
96Inventor score
Files withPANASONIC CORP15MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4TOSHIBA KK3TSUTSUE MAKOTO2UTSUMI MASAKI2
Top patents by PatentIndex Score
27 records- 0198US7859084B2Semiconductor substratePANASONIC CORP·Filed 2009·Granted Dec 28, 2010·124 cites·3 claims
- 0297US7838323B2Method for fabricating semiconductor devicePANASONIC CORP·Filed 2009·Granted Nov 23, 2010·114 cites·8 claims
- 0394US9673154B2Semiconductor devicePANASONIC CORP·Filed 2016·Granted Jun 6, 2017·7 cites·20 claims
- 0493US8618618B2Semiconductor deviceTSUTSUE MAKOTO·Filed 2012·Granted Dec 31, 2013·12 cites·22 claims
- 0593US7453128B2Semiconductor device and method for fabricating the samePANASONIC CORP·Filed 2004·Granted Nov 18, 2008·54 cites·6 claims
- 0689US8247876B2Semiconductor deviceTSUTSUE MAKOTO·Filed 2011·Granted Aug 21, 2012·7 cites·12 claims
- 0786US7777311B2Circuit substrate, molding semiconductor device, tray and inspection socketPANASONIC CORP·Filed 2008·Granted Aug 17, 2010·21 cites·19 claims
- 0885US8710595B2Semiconductor devicePANASONIC CORP·Filed 2013·Granted Apr 29, 2014·4 cites·20 claims
- 0983US6195677B1Distributed network computing system for data exchange/conversion between terminalsTOSHIBA KK·Filed 1998·Granted Feb 27, 2001·141 cites·63 claims
- 1080US7948039B2Semiconductor device and method for fabricating the samePANASONIC CORP·Filed 2008·Granted May 24, 2011·5 cites·24 claims
- 1180US6081978AResin-encapsulated semiconductor device producing apparatus and methodMATSUSHITA ELECTRONICS CORP·Filed 1999·Granted Jul 4, 2000·59 cites·16 claims
- 1278US9082779B2Semiconductor devicePANASONIC CORP·Filed 2014·Granted Jul 14, 2015·2 cites·16 claims
- 1375US5966451ADistributed network computing system, and data exchange apparatus and method and storage medium used in this systemTOSHIBA KK·Filed 1997·Granted Oct 12, 1999·93 cites·112 claims
- 1461US6603194B2Lead frame and method for fabricating resin-encapsulated semiconductor device using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 5, 2003·9 cites·13 claims
- 1560US6457040B1Method and system for a distributed network computing system for providing application servicesTOSHIBA KK·Filed 1999·Granted Sep 24, 2002·53 cites·25 claims
- 1656US2007287215A1Method for fabricating semiconductor deviceUTSUMI MASAKI·Filed 2007·Application pending·0 cites
- 1755US6835600B2Lead frame and method for fabricating resin-encapsulated semiconductor device using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Dec 28, 2004·6 cites·4 claims
- 1855US2015194391A1Semiconductor devicePANASONIC CORP·Filed 2015·Application pending·0 cites
- 1954US7994589B2Semiconductor device and method for fabricating the samePANASONIC CORP·Filed 2010·Granted Aug 9, 2011·0 cites·9 claims
- 2052US2008203538A1Semiconductor wafer with division guide patternMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 2151US2011039365A1Method for fabricating semiconductor devicePANASONIC CORP·Filed 2010·Application pending·0 cites
- 2250US2011108957A1Semiconductor substrate, semiconductor device and method of manufacturing the samePANASONIC CORP·Filed 2010·Application pending·0 cites
- 2347US2006163699A1Semiconductor wafer, semiconductor device manufacturing method, and semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 2438US2011204487A1Semiconductor device and electronic apparatusPANASONIC CORP·Filed 2011·Application pending·0 cites
- 2538US2011147871A1Semiconductor device and method of manufacturing the samePANASONIC CORP·Filed 2011·Application pending·0 cites
- 2638US2011147905A1Semiconductor device and method of manufacturing the samePANASONIC CORP·Filed 2011·Application pending·0 cites
- 2730US2012018820A1Semiconductor deviceUTSUMI MASAKI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →