Inventor · disambiguated record
Mao-Nan Wang
Also filed as: WANG MAO · WANG MAO-NAN
9 granted patents·17 pending applications·18 citations·filing 2014–2025
81Inventor score
Top patents by PatentIndex Score
26 records- 0192US11437331B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 6, 2022·6 cites·20 claims
- 0291US9893191B2FinFET transistor with u-shaped channelTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 13, 2018·9 cites·20 claims
- 0391US2025364457A1Chip structure with conductive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0485US12406952B2Chip structure with conductive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 0580US11189538B2Semiconductor structure with polyimide packaging and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 30, 2021·3 cites·20 claims
- 0677US2025364440A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0777US2025359210A1Through-substrate via and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0876US12057419B2Method for forming chip structure with conductive structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 0976US2025357277A1Through Via Power Delivery Structure for Stacked ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1076US2025357375A1Through via with guard ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1176US2025364397A1Semiconductor packaging structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1276US2025343131A1Semiconductor Structures And Methods Of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1375US2025357373A1Passive Device Structure Stress ReductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1474US2025349708A1Through-substrate-via cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1570US2025233054A1Through Via Power Delivery Structure for Stacked ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1669US2025140712A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1768US2025118655A1Through-substrate-via cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1867US12368094B2Semiconductor structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 1967US2024405069A1Through-substrate via and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2065US2024071956A1Through via with guard ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2163US12417973B2Semiconductor packaging structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 2257US2025157889A1Forming Multiple TSVs with Different Formation SchemesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2355US2025079339A1Semiconductor devices with dummy fill structures between a through silicon via and an active device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2453US12186847B2Selective field-assisted machining systemUNIV HUAZHONG SCIENCE TECH·Filed 2023·Granted Jan 7, 2025·0 cites·9 claims
- 2552US11222857B2Method of forming a photoresist over a bond pad to mitigate bond pad corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 11, 2022·0 cites·20 claims
- 2651US2024363492A1Semiconductor device having through via and method of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →