Inventor · disambiguated record
Mark Wilson
Also filed as: WILSON MARK · WILSON MARK H · WILSON MARK HARMON
7 granted patents·3 pending applications·79 citations·filing 2001–2023
84Inventor score
Top patents by PatentIndex Score
10 records- 0181US6533835B2Supplemental filter for an electronic componentFiled 2001·Granted Mar 18, 2003·34 cites·4 claims
- 0273US7213739B2Underfill fluxing curativeFRY METALS INC·Filed 2004·Granted May 8, 2007·17 cites·25 claims
- 0370US8890033B2Bond line heating pad systemBOEING CO·Filed 2013·Granted Nov 18, 2014·2 cites·8 claims
- 0468US7166491B2Thermoplastic fluxing underfill composition and methodFRY METALS INC·Filed 2003·Granted Jan 23, 2007·12 cites·43 claims
- 0563US8431866B2Method of installing and removing a bracket on a mounting surfaceWILSON MARK H·Filed 2008·Granted Apr 30, 2013·3 cites·3 claims
- 0658US7247683B2Low voiding no flow fluxing underfill for electronic devicesFRY METALS INC·Filed 2004·Granted Jul 24, 2007·11 cites·48 claims
- 0756US12221276B2Drainage system for draining viscous liquids from containersCHEVRON USA INC·Filed 2023·Granted Feb 11, 2025·0 cites·18 claims
- 0849US2008108178A1Thermoplastic fluxing underfill methodFRY METALS INC·Filed 2007·Application pending·0 cites
- 0949US2008110530A1Thermoplastic fluxing underfill compositionFRY METALS INC·Filed 2007·Application pending·0 cites
- 1036US2007020810A1Thermoplastic/thermoset composition material and method of attaching a wafer to a substrateCOOKSON SINGAPORE PTE LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →