Inventor · disambiguated record
Markus Wimplinger
Also filed as: WIMPLINGER MARKUS
70 granted patents·11 pending applications·163 citations·filing 2008–2024
98Inventor score
Top patents by PatentIndex Score
81 records- 0199US11990463B2Device for bonding chipsEV GROUP E THALLNER GMBH·Filed 2021·Granted May 21, 2024·5 cites·13 claims
- 0295US11562912B2Device and method for bonding of two substratesEV GROUP E THALLNER GMBH·Filed 2022·Granted Jan 24, 2023·2 cites·18 claims
- 0395US8640548B2Apparatus, device and method for determining alignment errorsWIMPLINGER MARKUS·Filed 2011·Granted Feb 4, 2014·23 cites·14 claims
- 0494US9312161B2Accommodating device for retaining wafersWIMPLINGER MARKUS·Filed 2010·Granted Apr 12, 2016·20 cites·17 claims
- 0593US11276589B2Device and method for bonding of two substratesEV GROUP E THALLNER GMBH·Filed 2021·Granted Mar 15, 2022·2 cites·15 claims
- 0693US10279575B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2013·Granted May 7, 2019·9 cites·9 claims
- 0792US11355374B2Accommodating device for retaining wafersEV GROUP E THALLNER GMBH·Filed 2020·Granted Jun 7, 2022·2 cites·2 claims
- 0892US10325798B2Accommodating device for retaining wafersEV GROUP E THALLNER GMBH·Filed 2015·Granted Jun 18, 2019·7 cites·8 claims
- 0992US10008424B2Measuring device and method for measuring layer thicknesses and defects in a wafer stackEV GROUP E THALLNER GMBH·Filed 2016·Granted Jun 26, 2018·7 cites·9 claims
- 1088US10964562B2Device and method for bonding of two substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Mar 30, 2021·4 cites·11 claims
- 1188US10886156B2Accomodating device for retaining wafersEV GROUP E THALLNER GMBH·Filed 2019·Granted Jan 5, 2021·3 cites·1 claims
- 1287US11059280B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jul 13, 2021·2 cites·7 claims
- 1386US9899223B2Apparatus and method for bonding substrates including changing a stoichiometry of oxide layers formed on the substratesEV GROUP E THALLNER GMBH·Filed 2013·Granted Feb 20, 2018·6 cites·8 claims
- 1485US8449716B2Device and method for separating a substrate from a carrier substrateWIMPLINGER MARKUS·Filed 2010·Granted May 28, 2013·6 cites·7 claims
- 1585US2023294390A1Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2023·Application pending·0 cites
- 1684US12456720B2Method for bonding of chipsEV GROUP E THALLNER GMBH·Filed 2024·Granted Oct 28, 2025·0 cites·8 claims
- 1784US2024421109A1Method for permanent connection of two metal surfacesEV GROUP E THALLNER GMBH·Filed 2024·Application pending·0 cites
- 1883US10490439B2Method and device for surface treatment of substratesEV GROUP E THALLNER GMBH·Filed 2018·Granted Nov 26, 2019·2 cites·16 claims
- 1981US11862487B2Device and method for bonding of two substratesEV GROUP E THALLNER GMBH·Filed 2022·Granted Jan 2, 2024·0 cites·11 claims
- 2081US10083854B2Method and device for surface treatment of substratesEV GROUP E THALLNER GMBH·Filed 2014·Granted Sep 25, 2018·3 cites·15 claims
- 2180US10109538B2Measuring device and method for measuring layer thicknesses and defects in a wafer stackWIMPLINGER MARKUS·Filed 2010·Granted Oct 23, 2018·4 cites·19 claims
- 2280US9067363B2Method and device for permanent bonding of wafers, as well as cutting toolMARTINSCHITZ KLAUS·Filed 2012·Granted Jun 30, 2015·6 cites·11 claims
- 2380US8975158B2Method for permanently bonding wafersPLACH THOMAS·Filed 2011·Granted Mar 10, 2015·7 cites·12 claims
- 2479US11756818B2Accommodating device for retaining wafersEV GROUP E THALLNER GMBH·Filed 2022·Granted Sep 12, 2023·0 cites·8 claims
- 2579US10239253B2Method for embossing of substratesEV GROUP E THALLNER GMBH·Filed 2015·Granted Mar 26, 2019·2 cites·13 claims
- 2679US9911713B2Method for applying a bonding layerEV GROUP E THALLNER GMBH·Filed 2017·Granted Mar 6, 2018·2 cites·20 claims
- 2778US11776842B2Method and device for surface treatment of substratesEV GROUP E THALLNER GMBH·Filed 2022·Granted Oct 3, 2023·0 cites·19 claims
- 2878US11697281B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2021·Granted Jul 11, 2023·0 cites·10 claims
- 2978US11282801B2Method for permanent connection of two metal surfacesEV GROUP E THALLNER GMBH·Filed 2016·Granted Mar 22, 2022·2 cites·4 claims
- 3076US9662846B2Method and device for producing a lens waferEV GROUP GMBH·Filed 2015·Granted May 30, 2017·1 cites·7 claims
- 3176US8927335B2Method for bonding of chips on wafersWIMPLINGER MARKUS·Filed 2010·Granted Jan 6, 2015·4 cites·25 claims
- 3275US9478518B2Method for permanent connection of two metal surfacesDRAGOI VIOREL·Filed 2011·Granted Oct 25, 2016·4 cites·11 claims
- 3374US12107057B2Method for permanent connection of two metal surfacesEV GROUP E THALLNER GMBH·Filed 2022·Granted Oct 1, 2024·0 cites·7 claims
- 3474US11348825B2Method and device for surface treatment of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted May 31, 2022·0 cites·18 claims
- 3574US9947638B2Device and method for permanent bondingEV GROUP E THALLNER GMBH·Filed 2015·Granted Apr 17, 2018·2 cites·11 claims
- 3673US11764198B2Method and device for bonding of chipsEV GROUP E THALLNER GMBH·Filed 2017·Granted Sep 19, 2023·1 cites·11 claims
- 3773US9627349B2Method for applying a bonding layerEV GROUP E THALLNER GMBH·Filed 2013·Granted Apr 18, 2017·2 cites·18 claims
- 3872US9116424B2Device for embossing of substratesLINDNER FRIEDRICH PAUL·Filed 2010·Granted Aug 25, 2015·2 cites·12 claims
- 3970US10279551B2Method for producing a microlensEV GROUP GMBH·Filed 2018·Granted May 7, 2019·0 cites·14 claims
- 4069US11020950B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·2 claims
- 4169US11020951B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·7 claims
- 4269US11020953B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·7 claims
- 4369US11020952B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·8 claims
- 4469US8597980B2Method for bonding of chips on wafersWIMPLINGER MARKUS·Filed 2009·Granted Dec 3, 2013·3 cites·27 claims
- 4568US9252042B2Method for permanent bonding of wafersPLACH THOMAS·Filed 2011·Granted Feb 2, 2016·2 cites·30 claims
- 4668US9159717B2Method for permanently bonding wafersPLACH THOMAS·Filed 2011·Granted Oct 13, 2015·3 cites·19 claims
- 4766US10668678B2Die tool, device and method for producing a lens waferEV GROUP GMBH·Filed 2017·Granted Jun 2, 2020·0 cites·17 claims
- 4866US9806054B2Flexible substrate holder, device and method for detaching a first substrateWIMPLINGER MARKUS·Filed 2011·Granted Oct 31, 2017·2 cites·20 claims
- 4966US9138978B2Device for separating a substrate from a carrier substrateEV GROUP GMBH·Filed 2013·Granted Sep 22, 2015·1 cites·8 claims
- 5065US10796944B2Method and device for surface treatment of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Oct 6, 2020·0 cites·25 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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