Device and method for bonding substrates

Abstract

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

1 . A method for bonding a first substrate to a second substrate on respective contact surfaces of the substrates, the method comprising:
 accommodating the first substrate on a first mounting surface of a first mounting apparatus and the second substrate on a second mounting surface of a second mounting apparatus;   bringing the contact surface of the first substrate into contact with the contact surface of the second substrate at a bond initiation site; and   bonding the first substrate to the second substrate along a bonding wave which is traveling from the bond initiation site to side edges of the substrates, the bonding comprising adjusting the first mounting surface and/or the second mounting surface in such a way that physical asymmetry of the first mounting surface and/or the second mounting surface is corrected by a gravitational field acting normally on the first mounting surface and/or the second mounting surface to enable a front of the bonding wave to move within a same horizontal plane and enable at least partial compensation of deformation of the first substrate and/or the second substrate.   
     
     
         2 . The method as claimed in  claim 1 , wherein the deformation of the first substrate and/or the second substrate depends on given factors that influence the traveling of the bonding wave. 
     
     
         3 . The method as claimed in  claim 1 , wherein the bond initiation site is located in a center of the contact surfaces. 
     
     
         4 . The method as claimed in  claim 1 , wherein the deformation of the first substrate and/or the second substrate takes place in a lateral direction, convexly, concavely, or a combination one or more thereof. 
     
     
         5 . The method as claimed in  claim 1 , wherein the deformation of the first substrate and/or the second substrate comprises one of expansion, compression, or curving the first substrate and/or the second substrate. 
     
     
         6 . The method as claimed in  claim 1 , wherein diameters of the substrates deviate from one another by less than 5 mm. 
     
     
         7 . The method as claimed in  claim 1 , wherein the deformation of the first substrate and/or the second substrate takes place through mechanically actuating and/or controlling a temperature of the first mounting apparatus and/or the second mounting apparatus. 
     
     
         8 . The method as claimed in  claim 1 , wherein the first substrate and/or the second substrate are fixed solely in a region of the side edges on the first and/or second mounting surfaces. 
     
     
         9 . A device for bonding of a first substrate to a second substrate on respective contact surfaces of the substrates, the device comprising:
 a first mounting apparatus configured to accommodate the first substrate on a first mounting surface;   a second mounting apparatus configured to accommodate the second substrate on a second mounting surface;   contact means for bringing the contact surface of the first substrate into contact with the contact surface of the second substrate at a bond initiation site; and   means for bonding the first substrate to the second substrate along a bonding wave which is traveling from the bond initiation site to side edges of the substrates, the bonding means comprising means for adjusting the first mounting surface and/or the second mounting surface in such a way that physical asymmetry of the first mounting surface and/or the second mounting surface is corrected by a gravitational field acting normally on the first mounting surface and/or the second mounting surface to enable a front of the bonding wave to move within a same horizontal plane and enable at least partial compensation of deformation of the first substrate and/or the second substrate.   
     
     
         10 . The device as claimed in  claim 9 , further comprising:
 deformation means for deforming the first substrate and/or the second substrate for alignment of the contact surfaces outside the bond initiation site before and/or during the bonding,   
     
     
         11 . The device as claimed in  claim 10 , wherein the deformation means is configured to encompass the first mounting apparatus, and
 wherein the first mounting apparatus is deformable on the first mounting surface in a lateral direction, convexly, concavely, or in a combination of one or more thereof.   
     
     
         12 . The device as claimed in  claim 10 , wherein the deformation means is configured to encompass the second mounting apparatus, and
 wherein the second mounting apparatus is deformable on the second mounting surface in a lateral direction, convexly, concavely, or in a combination of one or more thereof.   
     
     
         13 . The device as claimed in  claim 10 , wherein the deformation means comprises one or more of mechanical actuating means for mechanically actuating the first and/or second mounting apparatus and temperature control means for controlling a temperature of the first and/or second mounting apparatus. 
     
     
         14 . The device as claimed in  claim 9 , further comprising:
 fixing means for fixing the first substrate and/or the second substrate solely in a region of the side edges on the first and/or second mounting surfaces.