Assignee
EV GROUP E THALLNER GMBH
AT·145 granted patents·39 pending applications·235 citations·filing 2012–2025
Top patents by PatentIndex Score
184 records- 0199US11990463B2Device for bonding chipsEV GROUP E THALLNER GMBH·Filed 2021·Granted May 21, 2024·5 cites·13 claims
- 0295US11562912B2Device and method for bonding of two substratesEV GROUP E THALLNER GMBH·Filed 2022·Granted Jan 24, 2023·2 cites·18 claims
- 0395US10943807B2Method and device for alignment of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Mar 9, 2021·7 cites·23 claims
- 0495US10109487B2Method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Oct 23, 2018·10 cites·10 claims
- 0594US11282706B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Mar 22, 2022·7 cites·27 claims
- 0694US2026026410A1Method and device for bonding of chipsEV GROUP E THALLNER GMBH·Filed 2025·Application pending·0 cites
- 0793US11276589B2Device and method for bonding of two substratesEV GROUP E THALLNER GMBH·Filed 2021·Granted Mar 15, 2022·2 cites·15 claims
- 0893US10279575B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2013·Granted May 7, 2019·9 cites·9 claims
- 0992US11355374B2Accommodating device for retaining wafersEV GROUP E THALLNER GMBH·Filed 2020·Granted Jun 7, 2022·2 cites·2 claims
- 1092US10325798B2Accommodating device for retaining wafersEV GROUP E THALLNER GMBH·Filed 2015·Granted Jun 18, 2019·7 cites·8 claims
- 1192US10008424B2Measuring device and method for measuring layer thicknesses and defects in a wafer stackEV GROUP E THALLNER GMBH·Filed 2016·Granted Jun 26, 2018·7 cites·9 claims
- 1291US11527410B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2022·Granted Dec 13, 2022·1 cites·9 claims
- 1390US10468286B2Method for the bonding and debonding of substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Nov 5, 2019·8 cites·6 claims
- 1489US10692747B2Method and device for alignment of substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Jun 23, 2020·6 cites·18 claims
- 1589US10636662B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Apr 28, 2020·3 cites·17 claims
- 1689US10438822B2Method for prefixing of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Oct 8, 2019·3 cites·9 claims
- 1788US10964562B2Device and method for bonding of two substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Mar 30, 2021·4 cites·11 claims
- 1888US10886156B2Accomodating device for retaining wafersEV GROUP E THALLNER GMBH·Filed 2019·Granted Jan 5, 2021·3 cites·1 claims
- 1988US9851645B2Device and method for aligning substratesEV GROUP E THALLNER GMBH·Filed 2013·Granted Dec 26, 2017·8 cites·14 claims
- 2088US9418882B2Device and method for aligning substratesEV GROUP E THALLNER GMBH·Filed 2013·Granted Aug 16, 2016·9 cites·11 claims
- 2187US11251045B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Feb 15, 2022·1 cites·20 claims
- 2287US11059280B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jul 13, 2021·2 cites·7 claims
- 2387US10388545B2Device for alignment of two substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Aug 20, 2019·4 cites·20 claims
- 2486US9899223B2Apparatus and method for bonding substrates including changing a stoichiometry of oxide layers formed on the substratesEV GROUP E THALLNER GMBH·Filed 2013·Granted Feb 20, 2018·6 cites·8 claims
- 2586US9859246B2Method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2014·Granted Jan 2, 2018·6 cites·15 claims
- 2686US9666470B2Receptacle device, device and method for handling substrate stacksEV GROUP E THALLNER GMBH·Filed 2013·Granted May 30, 2017·5 cites·20 claims
- 2786US2025372571A1Apparatus and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2025·Application pending·0 cites
- 2885US10861699B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Dec 8, 2020·1 cites·20 claims
- 2985US10755929B2Method and device for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Aug 25, 2020·3 cites·13 claims
- 3085US9707650B2System and method for machining a workpieceEV GROUP E THALLNER GMBH·Filed 2014·Granted Jul 18, 2017·9 cites·17 claims
- 3185US2023294390A1Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2023·Application pending·0 cites
- 3284US12456720B2Method for bonding of chipsEV GROUP E THALLNER GMBH·Filed 2024·Granted Oct 28, 2025·0 cites·8 claims
- 3384US10748770B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Aug 18, 2020·1 cites·21 claims
- 3484US10024741B2Measuring device and method for ascertaining a pressure mapEV GROUP E THALLNER GMBH·Filed 2013·Granted Jul 17, 2018·15 cites·21 claims
- 3584US2024421109A1Method for permanent connection of two metal surfacesEV GROUP E THALLNER GMBH·Filed 2024·Application pending·0 cites
- 3683US11101132B2Method and device for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Aug 24, 2021·1 cites·8 claims
- 3783US10971378B2Method and device for bonding substratesEV GROUP E THALLNER GMBH·Filed 2018·Granted Apr 6, 2021·2 cites·7 claims
- 3883US10490439B2Method and device for surface treatment of substratesEV GROUP E THALLNER GMBH·Filed 2018·Granted Nov 26, 2019·2 cites·16 claims
- 3983US9640510B2Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areasEV GROUP E THALLNER GMBH·Filed 2013·Granted May 2, 2017·9 cites·13 claims
- 4082US11315901B2Method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2017·Granted Apr 26, 2022·3 cites·10 claims
- 4182US11121091B2Method for arranging two substratesEV GROUP E THALLNER GMBH·Filed 2017·Granted Sep 14, 2021·3 cites·11 claims
- 4282US2024213025A1Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2024·Application pending·0 cites
- 4381US11862487B2Device and method for bonding of two substratesEV GROUP E THALLNER GMBH·Filed 2022·Granted Jan 2, 2024·0 cites·11 claims
- 4481US10504730B2Device and method for bonding of substatesEV GROUP E THALLNER GMBH·Filed 2018·Granted Dec 10, 2019·1 cites·20 claims
- 4581US10083854B2Method and device for surface treatment of substratesEV GROUP E THALLNER GMBH·Filed 2014·Granted Sep 25, 2018·3 cites·15 claims
- 4680US12103787B2Method and device for transferring componentsEV GROUP E THALLNER GMBH·Filed 2020·Granted Oct 1, 2024·1 cites·13 claims
- 4780US10014193B2Method and device for bonding substratesEV GROUP E THALLNER GMBH·Filed 2014·Granted Jul 3, 2018·3 cites·21 claims
- 4879US12062521B2Method for prefixing of substratesEV GROUP E THALLNER GMBH·Filed 2022·Granted Aug 13, 2024·0 cites·3 claims
- 4979US11756818B2Accommodating device for retaining wafersEV GROUP E THALLNER GMBH·Filed 2022·Granted Sep 12, 2023·0 cites·8 claims
- 5079US11328939B2Method for prefixing of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted May 10, 2022·1 cites·18 claims
Showing the top 50 of 184 patent records by PatentIndex Score.
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