Method and device for bonding of chips

Abstract

A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

What is claimed is: 
     
         1 . A method operatively associated with a bond head of a bonding device for bonding chips onto at least one of a semiconductor substrate or onto further chips, comprising:
 forming a liquid film on points on the semiconductor substrate or on the further chips, which has or have a dielectric surface region and an electric surface region;   positioning the chips with their hybrid bond surfaces, which are the bond surfaces and have a dielectric surface region and an electric surface region, at the points on the semiconductor substrate or on the further chips, by the bond head;   using the bond head to bond the chips to the points on the semiconductor substrate or on the further chips by a direct bond, the chips being bonded onto the semiconductor substrate or onto the further chips in such a way that the chips are first bonded in the center onto the liquid film, then outwards onto the liquid film; and   releasing the chips from the fixation by the bond head, whereby the electric surface region of the chips and the electric surface region of the semiconductor substrate or of the further chips are aligned congruently with one another.   
     
     
         2 . The method according to  claim 1 , wherein to produce the chips, a substrate is fixed onto a carrier and then the substrate is separated into the chips. 
     
     
         3 . The method according to  claim 2 , wherein prior to fixing the substrate on the carrier, a bond surface of the substrate is cleaned. 
     
     
         4 . The method according to  claim 2 , wherein the bond surfaces of the chips are cleaned while removing them from the carrier and/or while transporting them to bond positions. 
     
     
         5 . The method according to  claim 3 , wherein the bond surfaces of the chips are cleaned while removing them from the carrier and/or while transporting them to bond positions. 
     
     
         6 . The method according to  claim 2 , wherein the chips are separated by mechanical separating means, joints having previously been introduced into the bond surface of the substrate. 
     
     
         7 . The method according to  claim 3 , wherein the chips are separated by mechanical separating means, joints having previously been introduced into the bond surface of the substrate. 
     
     
         8 . The method according to  claim 4 , wherein the chips are separated by mechanical separating means, joints having previously been introduced into the bond surface of the substrate.