Inventor · disambiguated record
Thomas Plach
Also filed as: PLACH THOMAS
29 granted patents·8 pending applications·57 citations·filing 2011–2025
95Inventor score
Top patents by PatentIndex Score
37 records- 0195US10109487B2Method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Oct 23, 2018·10 cites·10 claims
- 0294US11282706B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Mar 22, 2022·7 cites·27 claims
- 0393US10279575B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2013·Granted May 7, 2019·9 cites·9 claims
- 0491US11527410B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2022·Granted Dec 13, 2022·1 cites·9 claims
- 0589US10636662B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Apr 28, 2020·3 cites·17 claims
- 0687US11251045B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Feb 15, 2022·1 cites·20 claims
- 0787US11059280B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jul 13, 2021·2 cites·7 claims
- 0886US2025372571A1Apparatus and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2025·Application pending·0 cites
- 0985US10861699B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Dec 8, 2020·1 cites·20 claims
- 1085US2023294390A1Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2023·Application pending·0 cites
- 1184US10748770B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Aug 18, 2020·1 cites·21 claims
- 1282US11315901B2Method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2017·Granted Apr 26, 2022·3 cites·10 claims
- 1382US2024213025A1Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2024·Application pending·0 cites
- 1481US10504730B2Device and method for bonding of substatesEV GROUP E THALLNER GMBH·Filed 2018·Granted Dec 10, 2019·1 cites·20 claims
- 1580US8975158B2Method for permanently bonding wafersPLACH THOMAS·Filed 2011·Granted Mar 10, 2015·7 cites·12 claims
- 1678US11697281B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2021·Granted Jul 11, 2023·0 cites·10 claims
- 1776US11955339B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2021·Granted Apr 9, 2024·0 cites·17 claims
- 1875US12025426B2Measuring device and method for determining the course of a bonding waveEV GROUP E THALLNER GMBH·Filed 2019·Granted Jul 2, 2024·2 cites·15 claims
- 1974US10991609B2Method and substrate holder for the controlled bonding of substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Apr 27, 2021·2 cites·16 claims
- 2072US12412865B2Apparatus and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2022·Granted Sep 9, 2025·0 cites·16 claims
- 2169US11315813B2Substrate holder and method for bonding two substratesEV GROUP E THALLNER GMBH·Filed 2015·Granted Apr 26, 2022·2 cites·7 claims
- 2269US11020950B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·2 claims
- 2369US11020951B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·7 claims
- 2469US11020953B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·7 claims
- 2569US11020952B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·8 claims
- 2668US9252042B2Method for permanent bonding of wafersPLACH THOMAS·Filed 2011·Granted Feb 2, 2016·2 cites·30 claims
- 2768US9159717B2Method for permanently bonding wafersPLACH THOMAS·Filed 2011·Granted Oct 13, 2015·3 cites·19 claims
- 2856US12131907B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Oct 29, 2024·0 cites·6 claims
- 2953US2019006313A1Method for permanent bonding of wafersEV GROUP E THALLNER GMBH·Filed 2018·Application pending·0 cites
- 3052US10083933B2Method for permanent bonding of wafersEV GROUP E THALLNER GMBH·Filed 2015·Granted Sep 25, 2018·0 cites·15 claims
- 3149US2017229423A1Method for permanently bonding wafersEV GROUP E THALLNER GMBH·Filed 2017·Application pending·0 cites
- 3248US12199062B2Device and method for the alignment of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Jan 14, 2025·0 cites·20 claims
- 3346US2023369095A1Substrate holder and method for producing a substrate holder for bondingEV GROUP E THALLNER GMBH·Filed 2021·Application pending·0 cites
- 3446US2023207379A1Method and device for bonding substratesEV GROUP E THALLNER GMBH·Filed 2020·Application pending·0 cites
- 3545US10825793B2Method for permanently bonding wafersPLACH THOMAS·Filed 2011·Granted Nov 3, 2020·0 cites·8 claims
- 3638US2015165752A1Method and device for permanent bonding of wafersPLACH THOMAS·Filed 2012·Application pending·0 cites
- 3737US10707059B2Method and device for plasma treatment of substratesEV GROUP E THALLNER GMBH·Filed 2014·Granted Jul 7, 2020·0 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Thomas Plach files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →