Inventor · disambiguated record
Masaki Yanai
Also filed as: YANAI MASAKI
1 granted patent·15 pending applications·0 citations·filing 2020–2025
11Inventor score
Files withNISSAN CHEMICAL CORP16
Top patents by PatentIndex Score
16 records- 0179US2025376645A1Method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 0263US2025153225A1Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling compositionNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 0360US2025002685A1Thermosetting compositionNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 0458US2023131533A1Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 0558US2023129238A1Cleaning agent composition and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 0655US12297381B2Laminate, release agent composition, and method for manufacturing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Granted May 13, 2025·0 cites·6 claims
- 0749US2025092292A1Adhesive composition, laminate, method for producing laminate, and method for producing processed substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 0849US2025215294A1Adhesive containing polyether-modified siloxaneNISSAN CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 0949US2025316522A1Adhesive composition for release by light irradiation, laminate, and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 1048US2025084291A1Adhesive composition, laminate, and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 1146US2024199918A1Adhesive composition, laminate, method of manufacturing laminate, and method of manufacturing processed substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 1245US2023151307A1Method for manufacturing semiconductor substrate, method for manufacturing processed semiconductor substrate, and release compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 1345US2023343629A1Laminate and release agent compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 1445US2023131428A1Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peelingNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 1544US2022411684A1Adhesive composition, laminate and method for producing same, method for peeling laminate, and method for processing semiconductor-forming substrateNISSAN CHEMICAL CORP·Filed 2020·Application pending·0 cites
- 1643US2023298923A1Multilayer body, release agent composition, and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →