Inventor · disambiguated record
Masaaki Yasuda
Also filed as: YASUDA MASAAKI
32 granted patents·1 pending application·537 citations·filing 1987–2016
97Inventor score
Files withHITACHI CHEMICAL CO LTD12MITSUI PETROCHEMICAL IND6KAWAMORI TAKASHI5MURATA MANUFACTURING CO3MITSUI CHEMICALS INC2
Top patents by PatentIndex Score
33 records- 0193US5817155AEmulsion for hair treatmentSHISEIDO CO LTD·Filed 1996·Granted Oct 6, 1998·105 cites·14 claims
- 0291US7851131B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partHITACHI CHEMICAL CO LTD·Filed 2008·Granted Dec 14, 2010·13 cites·21 claims
- 0391US6223429B1Method of production of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1996·Granted May 1, 2001·145 cites·3 claims
- 0486US7061081B2Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jun 13, 2006·24 cites·24 claims
- 0584US8034659B2Production method of semiconductor device and bonding filmHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 11, 2011·12 cites·13 claims
- 0684US7070670B2Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jul 4, 2006·46 cites·42 claims
- 0781US5837791AUnsaturated copolymer of ethylene and process for preparing the sameMITSUI PETROCHEMICAL IND·Filed 1997·Granted Nov 17, 1998·24 cites·13 claims
- 0879US6303727B1Linear triene compound and copolymerMITSUI CHEMICALS INC·Filed 1999·Granted Oct 16, 2001·21 cites·9 claims
- 0978US9939375B2Concentration measurement deviceMURATA MANUFACTURING CO·Filed 2016·Granted Apr 10, 2018·2 cites·15 claims
- 1076US10254222B2Gas concentration measurement deviceMURATA MANUFACTURING CO·Filed 2016·Granted Apr 9, 2019·1 cites·20 claims
- 1176US8323873B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Dec 4, 2012·2 cites·21 claims
- 1276US8293453B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Oct 23, 2012·2 cites·9 claims
- 1375US8445177B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted May 21, 2013·2 cites·14 claims
- 1472US5698751ABranched polyene compounds and production thereofMITSUI PETROCHEMICAL IND·Filed 1995·Granted Dec 16, 1997·14 cites·17 claims
- 1568US6040407AChain polyene group-containing norbornene compound and unsaturated ethylene copolymer using the sameMITSUI PETROCHEMICAL IND·Filed 1995·Granted Mar 21, 2000·21 cites·10 claims
- 1664US7560307B2Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the sameHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jul 14, 2009·1 cites·6 claims
- 1763US6774501B2Resin-sealed semiconductor device, and die bonding material and sealing material for use thereinHITACHI CHEMICAL CO LTD·Filed 2001·Granted Aug 10, 2004·6 cites·24 claims
- 1861USD297953SJoystickKK ASCII·Filed 1987·Granted Oct 4, 1988·12 cites·1 claims
- 1960US7692296B2Semiconductor device and multilayer substrate thereforHITACHI CHEMICAL CO LTD·Filed 2005·Granted Apr 6, 2010·2 cites·13 claims
- 2060US5408013AUnsaturated polyester resin composition and sheet-form molding material using the sameHITACHI CHEMICAL CO LTD·Filed 1993·Granted Apr 18, 1995·10 cites·6 claims
- 2157US8673539B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2012·Granted Mar 18, 2014·0 cites·4 claims
- 2254US6404068B1Paste composition, and protective film and semiconductor device both obtained with the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jun 11, 2002·21 cites·19 claims
- 2353US8278024B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Oct 2, 2012·0 cites·20 claims
- 2447US2007110670A1Method for evaluating hair damage using an oxidized protein in hair as an indicatorSHISEIDO CO LTD·Filed 2004·Application pending·0 cites
- 2546US9915604B2Gas concentration measurement deviceMURATA MANUFACTURING CO·Filed 2016·Granted Mar 13, 2018·0 cites·20 claims
- 2644US5442121AProcess for producing N,N-disubstituted aminophenolMITSUI PETROCHEMICAL IND·Filed 1994·Granted Aug 15, 1995·3 cites·3 claims
- 2744US4783557AProcesses for preparing hydroxynaphthalenesMITSUI PETROCHEMICAL IND·Filed 1987·Granted Nov 8, 1988·3 cites·5 claims
- 2843US7942477B1Seat provided with electric or electronic equipmentTS TECH CO LTD·Filed 1999·Granted May 17, 2011·20 cites·5 claims
- 2943US5445877AUnsaturated polyester resin composition and sheet-form molding material using the sameHITACHI CHEMICAL CO LTD·Filed 1994·Granted Aug 29, 1995·7 cites·3 claims
- 3042US5910591AMethod of preparation of 4-hydroxy-1,2,2,6,6-pentamethylpiperidineMITSUI CHEMICALS INC·Filed 1997·Granted Jun 8, 1999·2 cites·9 claims
- 3138US6611064B1Semiconductor device and method for manufacturing the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Aug 26, 2003·8 cites·3 claims
- 3237US4962241AProcess for producing dihydroxynaphthalenesMITSUI PETROCHEMICAL IND·Filed 1988·Granted Oct 9, 1990·1 cites·17 claims
- 3331US5833313AAutomotive seatTOKYO SEAT KK·Filed 1996·Granted Nov 10, 1998·7 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →