Inventor · disambiguated record
Mei Fen Hiew
Also filed as: HIEW MEI FEN
4 granted patents·2 pending applications·3 citations·filing 2019–2024
59Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG6
Top patents by PatentIndex Score
6 records- 0187US11621204B2Molded semiconductor module having a mold step for increasing creepage distanceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 4, 2023·3 cites·22 claims
- 0270US12205874B2Semiconductor package with wire bond jointsINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0360US11842953B2Semiconductor package with wire bond joints and related methods of manufacturingINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 12, 2023·0 cites·18 claims
- 0456US2025201754A1Semiconductor device comprising a carrier, a semiconductor die and a c-shaped clip connected between themINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0554US12512380B2Semiconductor packages including a package body with grooves formed thereinINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 0638US2021043549A1Clips for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →