Inventor · disambiguated record
Meng-Wei Hsieh
Also filed as: HSIEH MENG-WEI
26 granted patents·3 pending applications·35 citations·filing 2004–2025
93Inventor score
Files withADVANCED SEMICONDUCTOR ENG25CHEN CHIEN-HUA1NOVATEK MICROELECTRONICS CORP1TAIWAN SEMICONDUCTOR MFG CO LTD1TSENG HUA-CHOU1
Top patents by PatentIndex Score
29 records- 0195US11342282B2Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 24, 2022·4 cites·26 claims
- 0291US8853819B2Semiconductor structure with passive element network and manufacturing method thereofCHEN CHIEN-HUA·Filed 2011·Granted Oct 7, 2014·16 cites·20 claims
- 0388US12374631B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 29, 2025·1 cites·14 claims
- 0488US11756896B2Semiconductor package structure including shielding layer contacting conductive contactADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Sep 12, 2023·2 cites·15 claims
- 0585US11508655B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 22, 2022·2 cites·18 claims
- 0682US11508668B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 22, 2022·1 cites·11 claims
- 0780US9711593B2Dummy gate for a high voltage transistor deviceTSENG HUA-CHOU·Filed 2012·Granted Jul 18, 2017·6 cites·16 claims
- 0876US2025234680A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0975US12272766B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Apr 8, 2025·0 cites·16 claims
- 1073US11935841B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Mar 19, 2024·0 cites·15 claims
- 1172US2025087606A1Semiconductor device package comprising antenna and communication moduleADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1269US12476177B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 1369US12463157B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Nov 4, 2025·0 cites·20 claims
- 1468US12132248B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Oct 29, 2024·0 cites·17 claims
- 1566US12300602B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 13, 2025·0 cites·17 claims
- 1666US11594660B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 28, 2023·0 cites·13 claims
- 1765US12154870B2Semiconductor device package comprising antenna and communication moduleADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Nov 26, 2024·0 cites·19 claims
- 1862US12513815B2Electronic device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 1959US11811131B2Antenna moduleADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 7, 2023·0 cites·13 claims
- 2059US11205627B2Semiconductor device package including emitting devices and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 21, 2021·0 cites·19 claims
- 2158US11538772B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 27, 2022·0 cites·16 claims
- 2257US11923825B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Mar 5, 2024·0 cites·1 claims
- 2356US11329015B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 10, 2022·0 cites·15 claims
- 2454US11798858B2Semiconductor package structure including reinforcement component and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 24, 2023·0 cites·16 claims
- 2552US11329016B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 10, 2022·0 cites·15 claims
- 2649US11581273B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 14, 2023·0 cites·11 claims
- 2746US2022157709A1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 2842US7368995B2Power amplifier with active bias circuitNOVATEK MICROELECTRONICS CORP·Filed 2004·Granted May 6, 2008·3 cites·17 claims
- 2940US9583564B2Isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 28, 2017·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →