Inventor · disambiguated record
Meng-Han Lee
Also filed as: LEE MENG-HAN
4 granted patents·1 citations·filing 2008–2011
56Inventor score
Top patents by PatentIndex Score
4 records- 0160US8878182B2Probe pad design for 3DIC package yield analysisWANG TZU-YU·Filed 2011·Granted Nov 4, 2014·1 cites·18 claims
- 0235US7877873B2Method for forming a wire bonding substrateNAN YA PRINTED CIRCUIT BOARD·Filed 2008·Granted Feb 1, 2011·0 cites·10 claims
- 0334US8058567B2High density package substrate and method for fabricating the sameLEE MENG-HAN·Filed 2008·Granted Nov 15, 2011·0 cites·11 claims
- 0425US8450624B2Supporting substrate and method for fabricating the sameLEE MENG-HAN·Filed 2010·Granted May 28, 2013·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →