Inventor · disambiguated record
Meng-Pei Lu
Also filed as: LU MENG-PEI
11 granted patents·20 pending applications·8 citations·filing 2012–2025
83Inventor score
Top patents by PatentIndex Score
31 records- 0195US11309241B2Protection liner on interconnect wire to enlarge processing window for overlying interconnect viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·3 cites·20 claims
- 0294US11682616B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 20, 2023·3 cites·20 claims
- 0390US12300599B2Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·1 cites·20 claims
- 0480US2025293162A1Integrated chip with graphene based interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0579US12347776B2Integrated chip with graphene based interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0676US11908794B2Protection liner on interconnect wire to enlarge processing window for overlying interconnect viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 0776US2025279351A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0876US2025372521A1Interconnect structure including topological materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0973US2024321632A1Semiconductor device including liner structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1073US2024363538A1Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1171US10879115B2Semiconductor device and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 29, 2020·1 cites·17 claims
- 1269US12218060B2Integrated chip with graphene based interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 1369US2023378067A1Semiconductor structure having verticle conductive graphene and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1465US12412837B2Interconnect structure including topological materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 1565US12068253B2Semiconductor structure with two-dimensional conductive structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
- 1665US2022352012A1Via structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1764US11551967B2Via structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 10, 2023·0 cites·20 claims
- 1861US2023066891A1Semiconductor structure having verticle conductive graphene and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 1960US12027419B2Semiconductor device including liner structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 2, 2024·0 cites·20 claims
- 2060US2025239449A1Semiconductor device structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2159US2025125251A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2256US2025300012A1Interconnect structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2356US2025293087A1Semiconductor device including super via and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2455US2025113499A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2554US2025079313A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2652US2023387239A1Semiconductor device including graphene barrier and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2750US2024055352A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2849US2024055496A1Semiconductor structure and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2949US2023352409A1Interconnect structure including single layer serving as both barrier layer and liner layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3041US2013112909A1Highly efficient thermoelectric materialLIAO CHIEN-NENG·Filed 2012·Application pending·0 cites
- 3132US2017170378A1Thermoelectric moduleNAT UNIV TSING HUA·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →