Inventor · disambiguated record
Mengzhi Pang
Also filed as: PANG MENGZHI
27 granted patents·18 pending applications·190 citations·filing 2005–2025
95Inventor score
Top patents by PatentIndex Score
45 records- 0198US9633974B2System in package fan out stacking architecture and process flowAPPLE INC·Filed 2015·Granted Apr 25, 2017·57 cites·16 claims
- 0297US9935076B1Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2016·Granted Apr 3, 2018·16 cites·10 claims
- 0397US9659907B2Double side mounting memory integration in thin low warpage fanout packageAPPLE INC·Filed 2015·Granted May 23, 2017·26 cites·20 claims
- 0491US11122678B2Packaged device having imbedded array of componentsTESLA INC·Filed 2020·Granted Sep 14, 2021·3 cites·14 claims
- 0589US10818632B1Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2018·Granted Oct 27, 2020·3 cites·14 claims
- 0689US7485017B2Pin grid array package substrate including pins having anchoring elementsINTEL CORP·Filed 2007·Granted Feb 3, 2009·20 cites·12 claims
- 0786US7569471B2Method of providing mixed size solder bumps on a substrate using a solder delivery headINTEL CORP·Filed 2006·Granted Aug 4, 2009·16 cites·7 claims
- 0885US11967528B2Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2023·Granted Apr 23, 2024·0 cites·20 claims
- 0983US9748227B2Dual-sided silicon integrated passive devicesAPPLE INC·Filed 2016·Granted Aug 29, 2017·3 cites·11 claims
- 1083US9236355B2EMI shielded wafer level fan-out pop packageAPPLE INC·Filed 2014·Granted Jan 12, 2016·7 cites·17 claims
- 1182US7485563B2Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the methodINTEL CORP·Filed 2006·Granted Feb 3, 2009·10 cites·11 claims
- 1281US9318474B2Thermally enhanced wafer level fan-out POP packageAPPLE INC·Filed 2014·Granted Apr 19, 2016·6 cites·15 claims
- 1379US2025167048A1Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator ModuleAPPLE INC·Filed 2025·Application pending·0 cites
- 1476US11973004B2Mechanical architecture for a multi-chip moduleTESLA INC·Filed 2019·Granted Apr 30, 2024·2 cites·9 claims
- 1576US11367680B2Electronic assembly having multiple substrate segmentsTESLA INC·Filed 2018·Granted Jun 21, 2022·2 cites·7 claims
- 1676US11069665B2Trimmable banked capacitorAPPLE INC·Filed 2018·Granted Jul 20, 2021·2 cites·23 claims
- 1775US11670548B2Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2020·Granted Jun 6, 2023·0 cites·18 claims
- 1873US7517788B2System, apparatus, and method for advanced solder bumpingINTEL CORP·Filed 2005·Granted Apr 14, 2009·5 cites·10 claims
- 1972US8508054B2Enhanced bump pitch scalingPANG MENGZHI·Filed 2011·Granted Aug 13, 2013·4 cites·22 claims
- 2068US8013444B2Solder joints with enhanced electromigration resistanceINTEL CORP·Filed 2008·Granted Sep 6, 2011·4 cites·5 claims
- 2167US12261110B2Electronic assembly having multiple substrate segmentsTESLA INC·Filed 2022·Granted Mar 25, 2025·0 cites·5 claims
- 2264US8957516B2Low cost and high performance flip chip packageBROADCOM CORP·Filed 2014·Granted Feb 17, 2015·2 cites·20 claims
- 2361US8395051B2Doping of lead-free solder alloys and structures formed therebyPANG MENGZHI·Filed 2008·Granted Mar 12, 2013·2 cites·6 claims
- 2455US7790598B2System, apparatus, and method for advanced solder bumpingINTEL CORP·Filed 2009·Granted Sep 7, 2010·0 cites·6 claims
- 2552US10103138B2Dual-sided silicon integrated passive devicesAPPLE INC·Filed 2017·Granted Oct 16, 2018·0 cites·14 claims
- 2650US2023317689A1Package-on-Package Assembly with Improved Thermal ManagementGOOGLE LLC·Filed 2021·Application pending·0 cites
- 2750US2024357769A1Heterogenous multi-layer structureTESLA INC·Filed 2022·Application pending·0 cites
- 2850US2024145432A1Cooled system-on-wafer with means for reducing the effects of electrostatic discharge and/or electromagnetic interferenceTESLA INC·Filed 2022·Application pending·0 cites
- 2948US2008242063A1Solder composition doped with a barrier component and method of making samePANG MENGZHI·Filed 2007·Application pending·0 cites
- 3047US11901310B2Electronic assemblyTESLA INC·Filed 2019·Granted Feb 13, 2024·0 cites·23 claims
- 3147US2024234243A1Electronic assemblies with thermal interface structureTESLA INC·Filed 2022·Application pending·0 cites
- 3246US2007145104A1System and method for advanced solder bumping using a disposable maskPANG MENGZHI·Filed 2005·Application pending·0 cites
- 3345US8759974B2Solder joints with enhanced electromigration resistancePANG MENGZHI·Filed 2011·Granted Jun 24, 2014·0 cites·13 claims
- 3445US2007269973A1Method of providing solder bumps using reflow in a forming gas atmosphereNALLA RAVI K·Filed 2006·Application pending·0 cites
- 3545US2015380392A1Package with memory die and logic die interconnected in a face-to-face configurationAPPLE INC·Filed 2014·Application pending·0 cites
- 3644US2025309155A1Embedded capacitor package substrateRIVIAN IP HOLDINGS LLC·Filed 2025·Application pending·0 cites
- 3743US2007148951A1System and method for flip chip substrate padPANG MENGZHI·Filed 2005·Application pending·0 cites
- 3843US2007155154A1System and method for solder bumping using a disposable mask and a barrier layerPANG MENGZHI·Filed 2005·Application pending·0 cites
- 3943US2008003804A1Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stagesNALLA RAVI·Filed 2006·Application pending·0 cites
- 4043US2025265220A1Multi-chip module package technology for advanced driver assistance system applicationRIVIAN IP HOLDINGS LLC·Filed 2025·Application pending·0 cites
- 4143US2009166864A1Method to prevent copper migration in a semiconductor packagePANG MENGZHI·Filed 2007·Application pending·0 cites
- 4241US2008160751A1Microelectronic die including solder caps on bumping sites thereof and method of making samePANG MENGZHI·Filed 2006·Application pending·0 cites
- 4339US2013187284A1Low Cost and High Performance Flip Chip PackagePANG MENGZHI·Filed 2012·Application pending·0 cites
- 4437US2013075907A1Interconnection Between Integrated Circuit and PackagePANG MENGZHI·Filed 2011·Application pending·0 cites
- 4533US7791185B2Pin grid array package substrate including pins having curved pin headsINTEL CORP·Filed 2007·Granted Sep 7, 2010·0 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Mengzhi Pang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →