Inventor · disambiguated record
Meiyee Shek
Also filed as: SHEK MEIYEE · SHEK MEIYEE MAGGIE LE
9 granted patents·7 pending applications·149 citations·filing 2002–2012
89Inventor score
Top patents by PatentIndex Score
16 records- 0196US7879683B2Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delayAPPLIED MATERIALS INC·Filed 2007·Granted Feb 1, 2011·35 cites·17 claims
- 0291US6656840B2Method for forming silicon containing layers on a substrateAPPLIED MATERIALS INC·Filed 2002·Granted Dec 2, 2003·54 cites·18 claims
- 0381US7718548B2Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interfaceAPPLIED MATERIALS INC·Filed 2007·Granted May 18, 2010·11 cites·16 claims
- 0480US7229911B2Adhesion improvement for low k dielectrics to conductive materialsAPPLIED MATERIALS INC·Filed 2004·Granted Jun 12, 2007·24 cites·9 claims
- 0576US7601651B2Method to improve the step coverage and pattern loading for dielectric filmsAPPLIED MATERIALS INC·Filed 2007·Granted Oct 13, 2009·4 cites·17 claims
- 0674US8236684B2Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layerCHAN KELVIN·Filed 2008·Granted Aug 7, 2012·4 cites·10 claims
- 0770US7371427B2Reduction of hillocks prior to dielectric barrier deposition in Cu damasceneAPPLIED MATERIALS INC·Filed 2003·Granted May 13, 2008·11 cites·6 claims
- 0859US7723228B2Reduction of hillocks prior to dielectric barrier deposition in Cu damasceneAPPLIED MATERIALS INC·Filed 2003·Granted May 25, 2010·6 cites·12 claims
- 0951US2008075888A1Reduction of hillocks prior to dielectric barrier deposition in cu damasceneAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 1049US2009011148A1Methods and apparatuses promoting adhesion of dielectric barrier film to copperAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 1147US2012276301A1Adhesion improvement of dielectric barrier to copper by the addition of thin interface layerLEE YONG-WON·Filed 2012·Application pending·0 cites
- 1245US7851385B2Low temperature conformal oxide formation and applicationsAPPLIED MATERIALS INC·Filed 2008·Granted Dec 14, 2010·0 cites·19 claims
- 1344US2009093100A1Method for forming an air gap in multilevel interconnect structureXIA LI-QUN·Filed 2007·Application pending·0 cites
- 1443US2009269923A1Adhesion and electromigration improvement between dielectric and conductive layersLEE SANG M·Filed 2008·Application pending·0 cites
- 1542US2005233555A1Adhesion improvement for low k dielectrics to conductive materialsRAJAGOPALAN NAGARAJAN·Filed 2004·Application pending·0 cites
- 1640US2005186339A1Methods and apparatuses promoting adhesion of dielectric barrier film to copperAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →