Inventor · disambiguated record
Meng Chu Tseng
Also filed as: TSENG MENG C · TSENG MENG CHU
9 granted patents·684 citations·filing 1993–2018
91Inventor score
Files withAPPLIED MATERIALS INC9
Top patents by PatentIndex Score
9 records- 0196US5500249AUniform tungsten silicide films produced by chemical vapor depositionAPPLIED MATERIALS INC·Filed 1993·Granted Mar 19, 1996·267 cites·11 claims
- 0292US5326725AClamping ring and susceptor thereforAPPLIED MATERIALS INC·Filed 1993·Granted Jul 5, 1994·166 cites·13 claims
- 0391US5817576AUtilization of SiH4 soak and purge in deposition processesAPPLIED MATERIALS INC·Filed 1996·Granted Oct 6, 1998·86 cites·33 claims
- 0488US5643633AUniform tungsten silicide films produced by chemical vapor depostitonAPPLIED MATERIALS INC·Filed 1995·Granted Jul 1, 1997·75 cites·15 claims
- 0579US5565382AProcess for forming tungsten silicide on semiconductor wafer using dichlorosilane gasAPPLIED MATERIALS INC·Filed 1993·Granted Oct 15, 1996·33 cites·28 claims
- 0667US10847463B2Seed layers for copper interconnectsAPPLIED MATERIALS INC·Filed 2018·Granted Nov 24, 2020·1 cites·9 claims
- 0765US5997950ASubstrate having uniform tungsten silicide film and method of manufactureAPPLIED MATERIALS INC·Filed 1997·Granted Dec 7, 1999·29 cites·47 claims
- 0860US5558910AUniform tungsten silicide films produced by chemical vapor depositionAPPLIED MATERIALS INC·Filed 1995·Granted Sep 24, 1996·24 cites·11 claims
- 0935US6193813B1Utilization of SiH4 soak and purge in deposition processesAPPLIED MATERIALS INC·Filed 1998·Granted Feb 27, 2001·3 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →