Inventor · disambiguated record
Meng-Jen Wang
Also filed as: WANG MENG · WANG MENG J · WANG MENG-JEN
63 granted patents·31 pending applications·474 citations·filing 2002–2025
98Inventor score
Top patents by PatentIndex Score
94 records- 0197US8786098B2Semiconductor element having conductive vias and semiconductor package having a semiconductor element with conductive vias and method for making the sameWANG MENG-JEN·Filed 2011·Granted Jul 22, 2014·42 cites·18 claims
- 0296US8252629B2Method for making a stackable packageYEE KUO-CHUNG·Filed 2010·Granted Aug 28, 2012·30 cites·20 claims
- 0394US7816265B2Method for forming vias in a substrateADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Oct 19, 2010·27 cites·20 claims
- 0494US7706149B2Micro-electro-mechanical-system package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Apr 27, 2010·38 cites·14 claims
- 0593US11682653B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 20, 2023·2 cites·13 claims
- 0693US10522505B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 31, 2019·7 cites·20 claims
- 0793US8310063B2Semiconductor package structure and manufacturing process thereofWANG MENG-JEN·Filed 2010·Granted Nov 13, 2012·19 cites·12 claims
- 0893US7811858B2Package and the method for making the same, and a stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Oct 12, 2010·24 cites·11 claims
- 0993US7625818B2Method for forming vias in a substrateADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Dec 1, 2009·28 cites·17 claims
- 1093US7250676B2Multi-package module with heat spreaderADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jul 31, 2007·32 cites·13 claims
- 1192US10937761B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 2, 2021·5 cites·15 claims
- 1288US11906638B2High-accuracy satellite positioning method, positioning terminal, and positioning systemHUAWEI TECH CO LTD·Filed 2021·Granted Feb 20, 2024·2 cites·16 claims
- 1386US11941323B2Meme creation method and apparatusHUAWEI TECH CO LTD·Filed 2022·Granted Mar 26, 2024·1 cites·15 claims
- 1486US7368806B2Flip chip package with anti-floating structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted May 6, 2008·18 cites·8 claims
- 1583US8072081B2Microelectromechanical system packageWANG MENG JEN·Filed 2008·Granted Dec 6, 2011·9 cites·20 claims
- 1683US7425468B2Method for making flip chip on leadframe packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Sep 16, 2008·16 cites·13 claims
- 1783US2025239569A1Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1882US12272671B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Apr 8, 2025·0 cites·10 claims
- 1982US8039393B2Semiconductor structure, method for manufacturing semiconductor structure and semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2011·Granted Oct 18, 2011·5 cites·20 claims
- 2081US11887967B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 30, 2024·1 cites·14 claims
- 2181US10242940B2Fan-out ball grid array package structure and process for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 26, 2019·4 cites·21 claims
- 2279US6833993B2Multichip packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 21, 2004·26 cites·29 claims
- 2379US6825567B1Face-to-face multi-chip flip-chip packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 30, 2004·26 cites·18 claims
- 2478US12101621B2Multimedia information processing method and apparatus, and storage mediumHUAWEI TECH CO LTD·Filed 2021·Granted Sep 24, 2024·1 cites·20 claims
- 2578US8415807B2Semiconductor structure and method for making the sameWANG MENG-JEN·Filed 2010·Granted Apr 9, 2013·4 cites·20 claims
- 2678US2024332274A1Optical device packageADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 2777US12438128B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted Oct 7, 2025·0 cites·12 claims
- 2876US7253508B2Semiconductor package with a flip chip on a solder-resist leadframeADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 7, 2007·24 cites·14 claims
- 2975US12009353B2Optical device package with compatible lid and carrierADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jun 11, 2024·0 cites·7 claims
- 3075US7573124B2Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Aug 11, 2009·7 cites·11 claims
- 3174US7375435B2Chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted May 20, 2008·6 cites·13 claims
- 3273US8466553B2Semiconductor device and semiconductor package having the sameCheng bing-hong·Filed 2010·Granted Jun 18, 2013·8 cites·16 claims
- 3372US8692362B2Semiconductor structure having conductive vias and method for manufacturing the sameWANG MENG-JEN·Filed 2011·Granted Apr 8, 2014·3 cites·15 claims
- 3471US11221733B2Application control method, graphical user interface, and terminalHUAWEI TECH CO LTD·Filed 2017·Granted Jan 11, 2022·2 cites·20 claims
- 3571US7164202B2Quad flat flip chip package and leadframe thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jan 16, 2007·17 cites·13 claims
- 3667US12068259B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Aug 20, 2024·0 cites·9 claims
- 3767US10083888B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 25, 2018·1 cites·17 claims
- 3867US7696060B2Recyclable stamp device and recyclable stamp process for wafer bondADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Apr 13, 2010·3 cites·20 claims
- 3965US8338235B2Package process of stacked type semiconductor device package structureWANG MENG-JEN·Filed 2010·Granted Dec 25, 2012·2 cites·8 claims
- 4064US8385873B2Equivalent radio frequency notch filter, radio frequency chip, and receiverHUAWEI TECH CO LTD·Filed 2011·Granted Feb 26, 2013·2 cites·20 claims
- 4164US7067904B2Flip-chip type quad flat package and leadframeADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jun 27, 2006·11 cites·12 claims
- 4263US11302682B2Optical device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 12, 2022·0 cites·20 claims
- 4362US11139274B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 5, 2021·0 cites·30 claims
- 4462US8350361B2Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive viaADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Jan 8, 2013·1 cites·18 claims
- 4561US12057129B2Audio coding method and apparatusHUAWEI TECH CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·18 claims
- 4661US7041531B2Method of fabricating flip chip ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 9, 2006·9 cites·3 claims
- 4759US6856027B2Multi-chips stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Feb 15, 2005·8 cites·14 claims
- 4858US12336149B2Heat sink and communication deviceHUAWEI TECH CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 4958US7833815B2Microelectromechanical system package and the method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 16, 2010·1 cites·20 claims
- 5057US2020194327A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
Showing the top 50 of 94 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →