Inventor · disambiguated record
Merrett Wong
Also filed as: WONG MERRETT · WONG MERRETT TINLOK
5 granted patents·13 pending applications·71 citations·filing 2015–2025
78Inventor score
Files withLAM RES CORP18
Top patents by PatentIndex Score
18 records- 0196US9543148B1Mask shrink layer for high aspect ratio dielectric etchLAM RES CORP·Filed 2015·Granted Jan 10, 2017·56 cites·19 claims
- 0294US12217972B2Multi-state pulsing for achieving a balance between bow control and mask selectivityLAM RES CORP·Filed 2020·Granted Feb 4, 2025·3 cites·26 claims
- 0392US10431458B2Mask shrink layer for high aspect ratio dielectric etchLAM RES CORP·Filed 2016·Granted Oct 1, 2019·11 cites·17 claims
- 0486US12278112B2Multiple state pulsing for high aspect ratio etchLAM RES CORP·Filed 2022·Granted Apr 15, 2025·1 cites·25 claims
- 0565US2025210364A1Multiple State Pulsing for High Aspect Ratio EtchLAM RES CORP·Filed 2025·Application pending·0 cites
- 0664US2025349514A1Multi-state rf pulsing to control mask shape and breaking selectivity versus process margin trade-offLAM RES CORP·Filed 2025·Application pending·0 cites
- 0763US2025140565A1Multi-state pulsing for achieving a balance between bow control and mask selectivityLAM RES CORP·Filed 2025·Application pending·0 cites
- 0852US12322571B2Multi-state RF pulsing to control mask shape and breaking selectivity versus process margin trade-offLAM RES CORP·Filed 2020·Granted Jun 3, 2025·0 cites·23 claims
- 0951US2025277148A1Organochloride etch with passivation and profile controlLAM RES CORP·Filed 2023·Application pending·0 cites
- 1051US2025166967A1Systems and methods for reducing variability in features of a substrateLAM RES CORP·Filed 2022·Application pending·0 cites
- 1150US2025308919A1Simultaneous dielectric etch with metal passivationLAM RES CORP·Filed 2023·Application pending·0 cites
- 1250US2024120209A1Systems and methods for etching a high aspect ratio structureLAM RES CORP·Filed 2021·Application pending·0 cites
- 1349US2025087456A1High selectivity and uniform dielectric etchLAM RES CORP·Filed 2023·Application pending·0 cites
- 1449US2025357135A1High aspect ratio etch with a metal or metalloid containing maskLAM RES CORP·Filed 2023·Application pending·0 cites
- 1548US2024429063A1Silicon etch with organochlorideLAM RES CORP·Filed 2022·Application pending·0 cites
- 1647US2025095964A1Method to control etch profile by rf pulsingLAM RES CORP·Filed 2022·Application pending·0 cites
- 1745US2023298896A1Metal-based liner protection for high aspect ratio plasma etchLAM RES CORP·Filed 2022·Application pending·0 cites
- 1844US2023230807A1Control of mask cdLAM RES CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →