Inventor · disambiguated record
Mitsuhiro Aizawa
Also filed as: AIZAWA MITSUHIRO
14 granted patents·8 pending applications·45 citations·filing 2001–2024
87Inventor score
Top patents by PatentIndex Score
22 records- 0190US7884632B2Semiconductor inspecting deviceSHINKO ELECTRIC ELECTRIC IND CO LTD·Filed 2009·Granted Feb 8, 2011·29 cites·5 claims
- 0288US11817381B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2021·Granted Nov 14, 2023·2 cites·13 claims
- 0375US9374889B2Interposer and electronic component packageSHINKO ELECTRIC IND CO·Filed 2014·Granted Jun 21, 2016·4 cites·6 claims
- 0469US9006894B2Wiring board and light emitting deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Apr 14, 2015·2 cites·8 claims
- 0566US7262076B2Method for production of semiconductor packageSHINKO ELECTRIC IND CO·Filed 2005·Granted Aug 28, 2007·4 cites·6 claims
- 0661US10319963B2Battery and method for producing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Jun 11, 2019·0 cites·12 claims
- 0761US8394678B2Semiconductor chip stacked body and method of manufacturing the sameMURAYAMA KEI·Filed 2009·Granted Mar 12, 2013·2 cites·21 claims
- 0859US2024234278A9Interconnect substrate, method of making the same, and semiconductor apparatusSHINKO ELECTRIC IND CO·Filed 2023·Application pending·0 cites
- 0958US9137890B2Wiring board and light emitting deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Sep 15, 2015·1 cites·8 claims
- 1058US2025174505A1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 1156US2024021556A1Connection structural body and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2023·Application pending·0 cites
- 1254US11706877B2Composite wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2022·Granted Jul 18, 2023·0 cites·14 claims
- 1351US10959328B2Wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrateSHINKO ELECTRIC IND CO·Filed 2020·Granted Mar 23, 2021·0 cites·8 claims
- 1446US9488677B2Probe card having a wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Nov 8, 2016·0 cites·6 claims
- 1545US9476913B2Probe cardSHINKO ELECTRIC IND CO·Filed 2014·Granted Oct 25, 2016·0 cites·6 claims
- 1645US9470718B2Probe cardSHINKO ELECTRIC IND CO·Filed 2014·Granted Oct 18, 2016·0 cites·5 claims
- 1743US6433415B2Assembly of plurality of semiconductor devicesSHINKO ELECTRIC IND CO·Filed 2001·Granted Aug 13, 2002·1 cites·12 claims
- 1842US2014151891A1Semiconductor packageSHINKO ELECTRIC IND CO·Filed 2013·Application pending·0 cites
- 1940US2004178462A1Semiconductor device and manufacturing method thereofFiled 2004·Application pending·0 cites
- 2037US2018204807A1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2018·Application pending·0 cites
- 2137US2011062596A1Semiconductor chip stacked structure and method of manufacturing sameSHINKO ELECTRIC IND CO·Filed 2010·Application pending·0 cites
- 2237US2010320598A1Semiconductor device and fabrication method thereofSHINKO ELECTRIC IND CO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →