Inventor · disambiguated record
Michael Ball
Also filed as: BALL MICHAEL · BALL MICHAEL B · BALL MICHAEL BRYAN
32 granted patents·4 pending applications·2,072 citations·filing 1990–2021
98Inventor score
Files withMICRON TECHNOLOGY INC23BALL MICHAEL B2MICRON SEMICONDUCTOR INC2NEMIROVSKY PAUL2VWS UK LTD2
Top patents by PatentIndex Score
36 records- 0199US5323060AMultichip module having a stacked chip arrangementMICRON SEMICONDUCTOR INC·Filed 1993·Granted Jun 21, 1994·590 cites·5 claims
- 0298US5291061AMulti-chip stacked devicesMICRON SEMICONDUCTOR INC·Filed 1993·Granted Mar 1, 1994·332 cites·2 claims
- 0397US6234874B1Wafer processing apparatusMICRON TECHNOLOGY INC·Filed 1999·Granted May 22, 2001·125 cites·18 claims
- 0497US6074286AWafer processing apparatus and method of processing a wafer utilizing a processing slurryMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 13, 2000·125 cites·29 claims
- 0595US6116988AMethod of processing a wafer utilizing a processing slurryMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 12, 2000·96 cites·6 claims
- 0693US6354917B1Method of processing a wafer utilizing a processing slurryMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 12, 2002·33 cites·25 claims
- 0789US6399464B1Packaging die preparationMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 4, 2002·48 cites·33 claims
- 0887US5827112AMethod and apparatus for grinding wafersMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 27, 1998·82 cites·18 claims
- 0984US6165887AMethod of improving interconnect of semiconductor devices by using a flattened ball bondMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 26, 2000·48 cites·4 claims
- 1084US5827111AMethod and apparatus for grinding wafersMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 27, 1998·57 cites·20 claims
- 1183US6403449B1Method of relieving surface tension on a semiconductor waferMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 11, 2002·24 cites·18 claims
- 1281US6641459B2Method for conserving a resource by flow interruptionMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 4, 2003·18 cites·7 claims
- 1380US6621147B2In-process device with grooved coating layer on a semiconductor wafer for relieving surface tensionMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 16, 2003·20 cites·15 claims
- 1477US6855623B2Recessed tape and method for forming a BGA assemblyMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 15, 2005·20 cites·64 claims
- 1574US6120360AApparatus for processing a planar structureMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 19, 2000·31 cites·5 claims
- 1671US6394119B2Method for conserving a resource by flow interruptionMICRON TECHNOLOGY INC·Filed 2001·Granted May 28, 2002·9 cites·8 claims
- 1770US5652841AMethod and apparatus for aggregating terminals into clusters to assist in the construction of a distributed data communication networkFiled 1995·Granted Jul 29, 1997·92 cites·51 claims
- 1869US5426674AMethod and computer system for selecting and evaluating data routes and arranging a distributed data communication networkFiled 1993·Granted Jun 20, 1995·63 cites·26 claims
- 1969US5216591AMethod for efficient distributed data communications network backbone node locationSPRINT INT COMMUNICATION CO·Filed 1990·Granted Jun 1, 1993·47 cites·11 claims
- 2067US6363968B1System for conserving a resource by flow interruptionMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 2, 2002·7 cites·15 claims
- 2166US5253161AMethod for routing data in a near-optimal manner in a distributed data communications networkNEMIROVSKY PAUL·Filed 1990·Granted Oct 12, 1993·61 cites·14 claims
- 2265US6162703APackaging die preparationMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 19, 2000·29 cites·24 claims
- 2362US6371840B1Method and apparatus for processing a planar structureMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 16, 2002·7 cites·6 claims
- 2461US6240942B1Method for conserving a resource by flow interruptionMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 5, 2001·17 cites·20 claims
- 2559US5079760AMethod for efficient distributed data communications network access network configurationNEMIROVSKY PAUL·Filed 1990·Granted Jan 7, 1992·33 cites·8 claims
- 2656US5404451ASystem for identifying candidate link, determining underutilized link, evaluating addition of candidate link and removing of underutilized link to reduce network costFiled 1993·Granted Apr 4, 1995·36 cites·10 claims
- 2753US2023339795A1Apparatus and method for providing purified waterVWS UK LTD·Filed 2021·Application pending·0 cites
- 2852US6539855B2Method and apparatus for screen printingMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 1, 2003·3 cites·28 claims
- 2952US2006157532A1Apparatus of clamping semiconductor devices using sliding finger supportsBALL MICHAEL B·Filed 2005·Application pending·0 cites
- 3051US6289803B1Method and apparatus for screen printingMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 18, 2001·3 cites·35 claims
- 3151US2007117266A1Method of fabricating a multi-die semiconductor package assemblyBALL MICHAEL B·Filed 2007·Application pending·0 cites
- 3247US10961144B2Method and apparatus for providing ultrapure waterVWS UK LTD·Filed 2017·Granted Mar 30, 2021·0 cites·11 claims
- 3347US5920769AMethod and apparatus for processing a planar structureMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 6, 1999·9 cites·16 claims
- 3441US6351022B1Method and apparatus for processing a planar structureMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 26, 2002·6 cites·14 claims
- 3540US2005098887A1Using backgrind wafer tape to enable wafer mounting of bumped wafersFiled 2004·Application pending·0 cites
- 3632US6234077B1Method and apparatus for screen printingMICRON TECHNOLOGY INC·Filed 1999·Granted May 22, 2001·1 cites·41 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →