Inventor · disambiguated record
Michael Barrow
Also filed as: BARROW MICHAEL · BARROW MICHAEL A
36 granted patents·2 pending applications·1,164 citations·filing 1983–2021
98Inventor score
Top patents by PatentIndex Score
38 records- 0198US5894410APerimeter matrix ball grid array circuit package with a populated centerINTEL CORP·Filed 1997·Granted Apr 13, 1999·131 cites·29 claims
- 0297US7898093B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 1, 2011·50 cites·8 claims
- 0395US8476748B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2012·Granted Jul 2, 2013·15 cites·20 claims
- 0493US5898219ACustom corner attach heat sink design for a plastic ball grid array integrated circuit packageINTEL CORP·Filed 1997·Granted Apr 27, 1999·122 cites·10 claims
- 0592US8847372B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 30, 2014·8 cites·20 claims
- 0691US8368194B1Exposed die overmolded flip chip packageAMKOR TECHNOLOGY INC·Filed 2012·Granted Feb 5, 2013·8 cites·17 claims
- 0791US4560962AMultilayered printed circuit board with controlled 100 ohm impedanceBURROUGHS CORP·Filed 1983·Granted Dec 24, 1985·62 cites·2 claims
- 0890US8541260B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 24, 2013·7 cites·20 claims
- 0990US5875102AEclipse via in pad structureINTEL CORP·Filed 1997·Granted Feb 23, 1999·106 cites·10 claims
- 1089US5706178ABall grid array integrated circuit package that has vias located within the solder pads of a packageINTEL CORP·Filed 1996·Granted Jan 6, 1998·90 cites·13 claims
- 1184US4553111APrinted circuit board maximizing areas for component utilizationBURROUGHS CORP·Filed 1983·Granted Nov 12, 1985·45 cites·5 claims
- 1283US6146921ACavity mold cap BGA package with post mold thermally conductive epoxy attach heat sinkINTEL CORP·Filed 1998·Granted Nov 14, 2000·67 cites·16 claims
- 1381US8109765B2Intelligent tutoring feedbackBEATTIE VALERIE L·Filed 2004·Granted Feb 7, 2012·49 cites·29 claims
- 1481US5889655AIntegrated circuit package substrate with stepped solder mask openingsINTEL CORP·Filed 1997·Granted Mar 30, 1999·62 cites·7 claims
- 1579US8207022B1Exposed die overmolded flip chip package methodDARVEAUX ROBERT FRANCIS·Filed 2011·Granted Jun 26, 2012·3 cites·20 claims
- 1679US5796589ABall grid array integrated circuit package that has vias located within the solder pads of a packageINTEL CORP·Filed 1995·Granted Aug 18, 1998·49 cites·15 claims
- 1776US5936848AElectronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the viasINTEL CORP·Filed 1998·Granted Aug 10, 1999·56 cites·17 claims
- 1872US6521845B1Thermal spreading enhancements for motherboards using PBGAsINTEL CORP·Filed 1997·Granted Feb 18, 2003·40 cites·18 claims
- 1971US6747362B2Perimeter matrix ball grid array circuit package with a populated centerINTEL CORP·Filed 1999·Granted Jun 8, 2004·19 cites·30 claims
- 2065US5801450AVariable pitch stagger die for optimal densityINTEL CORP·Filed 1996·Granted Sep 1, 1998·30 cites·7 claims
- 2160US7543377B2Perimeter matrix ball grid array circuit package with a populated centerINTEL CORP·Filed 2007·Granted Jun 9, 2009·1 cites·14 claims
- 2259US5917702ACorner heat sink which encloses an integrated circuit of a ball grid array integrated circuit packageINTEL CORP·Filed 1997·Granted Jun 29, 1999·23 cites·9 claims
- 2358US6420651B1Integrated circuit package with bond wires at the corners of an integrated circuitINTEL CORP·Filed 2001·Granted Jul 16, 2002·7 cites·5 claims
- 2458US5867367AQuad flat pack integrated circuit packageINTEL CORP·Filed 1997·Granted Feb 2, 1999·15 cites·6 claims
- 2555US5812379ASmall diameter ball grid array pad size for improved motherboard routingINTEL CORP·Filed 1996·Granted Sep 22, 1998·19 cites·9 claims
- 2653US6297078B1Integrated circuit package with bond wires at the corners of an integrated circuitINTEL CORP·Filed 1997·Granted Oct 2, 2001·16 cites·4 claims
- 2753US6118182AIntegrated circuit package with rectangular contact padsINTEL CORP·Filed 1998·Granted Sep 12, 2000·17 cites·4 claims
- 2853US5880529ASilicon metal-pillar conductors under stagger bond padsINTEL CORP·Filed 1996·Granted Mar 9, 1999·18 cites·14 claims
- 2952US9684293B2Refrigerant relief valve monitoring system and methodBRT LLC·Filed 2014·Granted Jun 20, 2017·2 cites·13 claims
- 3049US2006180345A1Perimeter matrix ball grid array circuit package with a populated centerBARROW MICHAEL·Filed 2005·Application pending·0 cites
- 3147US5978224AQuad flat pack integrated circuit packageINTEL CORP·Filed 1998·Granted Nov 2, 1999·9 cites·4 claims
- 3245US11911128B2Wireless neural recording devices and system with two stage RF and NIR power delivery and programmingUNIV MICHIGAN REGENTS·Filed 2021·Granted Feb 27, 2024·0 cites·31 claims
- 3341US2004262038A1Perimeter matrix ball grid array circuit package with a populated centerBARROW MICHAEL·Filed 2001·Application pending·0 cites
- 3436US6498390B1Integrated circuit package that includes a thermally conductive tape which attaches a thermal element to a plastic housingINTEL CORP·Filed 1998·Granted Dec 24, 2002·5 cites·14 claims
- 3536US5949651AQuad flat pack integrated circuit packageINTEL CORP·Filed 1998·Granted Sep 7, 1999·3 cites·6 claims
- 3635US6255135B1Quad flat pack integrated circuit packageINTEL CORP·Filed 1998·Granted Jul 3, 2001·3 cites·32 claims
- 3731US6110762AMethod of manufacturing a custom corner attach heat sink design for a plastic ball grid array integrated circuit packageINTEL CORP·Filed 1999·Granted Aug 29, 2000·1 cites·10 claims
- 3826US4507931ABottling plant cooling systemsBARROW SYSTEMS INC·Filed 1984·Granted Apr 2, 1985·6 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →