Inventor · disambiguated record
Michael Berger
Also filed as: BERGER MICHAEL · BERGER MICHAEL J
28 granted patents·1 pending application·824 citations·filing 1976–2016
97Inventor score
Top patents by PatentIndex Score
29 records- 0196US7730035B2Method, system and program product for managing a file system that includes an archiveIBM·Filed 2005·Granted Jun 1, 2010·157 cites·22 claims
- 0294US6682872B2UV-curable compositions and method of use thereof in microelectronicsIBM·Filed 2002·Granted Jan 27, 2004·90 cites·20 claims
- 0390US5268306APreparation of a solid phase matrix containing a bound specific binding pairBOEHRINGER MANNHEIM GMBH·Filed 1991·Granted Dec 7, 1993·98 cites·13 claims
- 0487US7727763B2Differentiation of multi-lineage progenitor cells to respiratory epithelial cellsBIOE LLC·Filed 2007·Granted Jun 1, 2010·24 cites·7 claims
- 0587US6287126B1Mechanical attachment means used as electrical connectionIBM·Filed 1999·Granted Sep 11, 2001·58 cites·48 claims
- 0685US5773561APolymer sealants/adhesives and use thereof in electronic package assemblyIBM·Filed 1996·Granted Jun 30, 1998·43 cites·21 claims
- 0783US5212063ALigand trap useful in immunoassays of biotin or free biotin containing samples and improved immunoassays using these ligand trapsBOEHRINGER MANNHEIM GMBH·Filed 1990·Granted May 18, 1993·66 cites·9 claims
- 0882US4225631AAbrasion resistant coatings for unsaturated polymeric substratesITEK CORP·Filed 1976·Granted Sep 30, 1980·32 cites·18 claims
- 0972US5193732AApparatus and methods for making simultaneous electrical connectionsIBM·Filed 1991·Granted Mar 16, 1993·49 cites·13 claims
- 1070US5700581ASolvent-free epoxy based adhesives for semiconductor chip attachment and processIBM·Filed 1996·Granted Dec 23, 1997·39 cites·22 claims
- 1162US7294909B2Electronic package repair processIBM·Filed 2005·Granted Nov 13, 2007·2 cites·14 claims
- 1262US7199450B2Materials and method to seal vias in silicon substratesIBM·Filed 2005·Granted Apr 3, 2007·2 cites·7 claims
- 1362US5288007AApparatus and methods for making simultaneous electrical connectionsIBM·Filed 1992·Granted Feb 22, 1994·33 cites·19 claims
- 1461US4324853APhotographic processing composition containing polyolPOLAROID CORP·Filed 1979·Granted Apr 13, 1982·6 cites·19 claims
- 1559US6274325B1Method for carrying out a homogeneous-immunoassay based on agglutinationBOEHRINGER MANNHEIM GMBH·Filed 1994·Granted Aug 14, 2001·22 cites·14 claims
- 1659US5446961AMethod for repairing semiconductor substratesIBM·Filed 1993·Granted Sep 5, 1995·26 cites·16 claims
- 1758US4383022ADiffusion transfer film unit with protective layer of water soluble copper salt, chitosan and gelatinPOLAROID CORP·Filed 1982·Granted May 10, 1983·7 cites·19 claims
- 1856US5493076AStructure for repairing semiconductor substratesIBM·Filed 1995·Granted Feb 20, 1996·21 cites·13 claims
- 1954US10533077B2Method for bonding using adhesive layers with the aid of a laserHENKEL AG & CO KGAA·Filed 2016·Granted Jan 14, 2020·0 cites·14 claims
- 2054US4366227ADiffusion transfer film unitPOLAROID CORP·Filed 1981·Granted Dec 28, 1982·7 cites·30 claims
- 2152US4386151ADiffusion transfer film system with protective layer of copper salt, chitosan and selected polyolsPOLAROID CORP·Filed 1982·Granted May 31, 1983·6 cites·25 claims
- 2250US7608295B2Polyimide compositions and use thereof in ceramic product defect repairIBM·Filed 2007·Granted Oct 27, 2009·0 cites·8 claims
- 2349US5955543AAryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resinIBM·Filed 1997·Granted Sep 21, 1999·14 cites·18 claims
- 2445US7018457B2Azo metal-complexed dyes, ink jet ink compositions and ink jet printing methodsPOLAROID CORP·Filed 2003·Granted Mar 28, 2006·0 cites·13 claims
- 2544US6916670B2Electronic package repair processIBM·Filed 2003·Granted Jul 12, 2005·1 cites·25 claims
- 2641US5507872AContact sensor-based microdispensing toolIBM·Filed 1994·Granted Apr 16, 1996·12 cites·8 claims
- 2739US2004132900A1Polyimide compositions and use thereof in ceramic product defect repairIBM·Filed 2003·Application pending·0 cites
- 2838US6114450AAryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resinIBM·Filed 1999·Granted Sep 5, 2000·7 cites·12 claims
- 2932US4767691APhotographic film assemblagePOLAROID CORP·Filed 1987·Granted Aug 30, 1988·2 cites·11 claims
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