Inventor · disambiguated record
Michael R. Bruce
Also filed as: BRUCE MICHAEL · BRUCE MICHAEL R · BRUCE MICHAEL RICHARD
81 granted patents·2 pending applications·1,321 citations·filing 1998–2014
99Inventor score
Files withADVANCED MICRO DEVICES INC71ROSS LARRY2ADVANCE MICRO DEVICES INC1ADVANCED MIRCOR DEVICES INC1GLOBALFOUNDRIES INC1
Top patents by PatentIndex Score
83 records- 0197US6549022B1Apparatus and method for analyzing functional failures in integrated circuitsSANDIA CORP·Filed 2000·Granted Apr 15, 2003·187 cites·55 claims
- 0296US6608494B1Single point high resolution time resolved photoemission microscopy system and methodADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 19, 2003·134 cites·32 claims
- 0396US6488405B1Flip chip defect analysis using liquid crystalADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 3, 2002·113 cites·36 claims
- 0495US6483327B1Quadrant avalanche photodiode time-resolved detectionADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 19, 2002·123 cites·22 claims
- 0588US6850081B1Semiconductor die analysis via fiber optic communicationADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 1, 2005·37 cites·7 claims
- 0680US6403388B1Nanomachining method for integrated circuitsADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 11, 2002·23 cites·20 claims
- 0779US7088852B1Three-dimensional tomographyADVANCED MICRO DEVICES INC·Filed 2001·Granted Aug 8, 2006·16 cites·13 claims
- 0879US6391664B1Selectively activatable solar cells for integrated circuit analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted May 21, 2002·52 cites·19 claims
- 0978US6375347B1Method for laser scanning flip-chip integrated circuitsADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 23, 2002·21 cites·19 claims
- 1075US6897664B1Laser beam induced phenomena detectionSEMICAPS PTE LTD·Filed 2002·Granted May 24, 2005·24 cites·22 claims
- 1174US10012692B2Precision probe positioning for at-speed integrated circuit testing using through silicon in-circuit logic analysisROSS LARRY·Filed 2014·Granted Jul 3, 2018·4 cites·16 claims
- 1274US6780664B1Nanotube tip for atomic force microscopeADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 24, 2004·22 cites·28 claims
- 1372US6994584B1Thermally conductive integrated circuit mounting structuresADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 7, 2006·25 cites·14 claims
- 1471US7196800B1Semiconductor die analysis as a function of optical reflections from the dieADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 27, 2007·15 cites·21 claims
- 1570US6657446B1Picosecond imaging circuit analysis probe and systemADVANCED MICRO DEVICES INC·Filed 1999·Granted Dec 2, 2003·32 cites·14 claims
- 1670US6500699B1Test fixture for future integrationADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 31, 2002·14 cites·21 claims
- 1769US6469529B1Time-resolved emission microscopy systemADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 22, 2002·14 cites·40 claims
- 1868US6709985B1Arrangement and method for providing an imaging path using a silicon-crystal damaging laserADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 23, 2004·32 cites·15 claims
- 1966US8232586B2Silicon photon detectorPOTOK RONALD M·Filed 2009·Granted Jul 31, 2012·2 cites·17 claims
- 2066US7272010B1Thermally conductive integrated circuit mounting structuresADVANCED MICRO DEVICES INC·Filed 2006·Granted Sep 18, 2007·7 cites·17 claims
- 2166US6146014AMethod for laser scanning flip-chip integrated circuitsADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 14, 2000·23 cites·25 claims
- 2265US6448095B1Circuit access and analysis for a SOI flip-chip dieADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 10, 2002·9 cites·20 claims
- 2365US6417680B1Method and apparatus for stress testing a semiconductor device using laser-induced circuit excitationADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 9, 2002·24 cites·20 claims
- 2465US6387715B1Integrated circuit defect detection via laser heat and IR thermographyADVANCED MICRO DEVICES INC·Filed 1999·Granted May 14, 2002·27 cites·20 claims
- 2564US6546513B1Data processing device test apparatus and method thereforADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 8, 2003·11 cites·26 claims
- 2664US6281025B1Substrate removal as a function of SIMS analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 28, 2001·28 cites·21 claims
- 2760US6864972B1IC die analysis via back side lensADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 8, 2005·2 cites·20 claims
- 2860US6844928B1Fiber optic semiconductor analysis arrangement and method thereforADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 18, 2005·3 cites·19 claims
- 2960US6828809B1Photon detection enhancement of superconducting hot-electron photodetectorsADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 7, 2004·9 cites·28 claims
- 3060US6714294B1De broglie microscopeADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 30, 2004·2 cites·49 claims
- 3159US6894518B1Circuit analysis and manufacture using electric field-induced effectsADVANCED MICRO DEVICES INC·Filed 2002·Granted May 17, 2005·8 cites·26 claims
- 3259US6833716B1Electro-optical analysis of integrated circuitsADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 21, 2004·9 cites·20 claims
- 3358US6716683B1Optical analysis for SOI integrated circuitsADVANCED MIRCOR DEVICES INC·Filed 2001·Granted Apr 6, 2004·6 cites·30 claims
- 3458US6566888B1Repair of resistive electrical connections in an integrated circuitADVANCED MICRO DEVICES INC·Filed 2001·Granted May 20, 2003·8 cites·23 claims
- 3557US8048689B2Semiconductor chip with backside conductor structureGLOBALFOUNDRIES INC·Filed 2008·Granted Nov 1, 2011·0 cites·13 claims
- 3657US6836132B1High resolution heat exchangeADVANCE MICRO DEVICES INC·Filed 2002·Granted Dec 28, 2004·5 cites·20 claims
- 3757US6621281B1SOI die analysis of circuitry logic states via coupling through the insulatorADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 16, 2003·7 cites·21 claims
- 3857US6541987B1Laser-excited detection of defective semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 1, 2003·18 cites·23 claims
- 3957US6518783B1Circuit construction in back side of die and over a buried insulatorADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 11, 2003·7 cites·22 claims
- 4057US6414335B1Selective state change analysis of a SOI dieADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 2, 2002·7 cites·20 claims
- 4156US9714978B2At-speed integrated circuit testing using through silicon in-circuit logic analysisROSS LARRY·Filed 2013·Granted Jul 25, 2017·1 cites·28 claims
- 4256US7062399B1Resistivity analysisADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 13, 2006·9 cites·23 claims
- 4354US6483326B1Localized heating for defect isolation during die operationADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 19, 2002·15 cites·25 claims
- 4453US6833718B1Photon beaconADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 21, 2004·7 cites·16 claims
- 4553US6700659B1Semiconductor analysis arrangement and method thereforADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 2, 2004·6 cites·33 claims
- 4653US6686757B1Defect detection in semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1999·Granted Feb 3, 2004·16 cites·16 claims
- 4753US6576484B1IC die analysis via back side circuit construction with heat dissipationADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 10, 2003·5 cites·20 claims
- 4853US6430728B1Acoustic 3D analysis of circuit structuresADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 6, 2002·16 cites·22 claims
- 4952US6956385B1Integrated circuit defect analysis using liquid crystalADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 18, 2005·3 cites·24 claims
- 5051US8519391B2Semiconductor chip with backside conductor structureWANG LIANG·Filed 2011·Granted Aug 27, 2013·0 cites·6 claims
Showing the top 50 of 83 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →