Inventor · disambiguated record
Michael Chan
Also filed as: CHAN MICHAEL · CHAN MICHAEL Y · CHAN MICHAEL Y S · CHAN MICHAEL YUWAH
26 granted patents·2 pending applications·670 citations·filing 1990–2020
97Inventor score
Top patents by PatentIndex Score
28 records- 0195US5764489AApparatus for controlling the impedance of high speed signals on a printed circuit boardCOMPAQ COMPUTER CORP·Filed 1996·Granted Jun 9, 1998·101 cites·18 claims
- 0294US5118554AInterleaved towel fold configurationSCOTT PAPER CO·Filed 1990·Granted Jun 2, 1992·102 cites·12 claims
- 0393US8421225B2Three-dimensional stacked substrate arrangementsRAMANATHAN SHRIRAM·Filed 2012·Granted Apr 16, 2013·14 cites·8 claims
- 0492US7906392B2Pillar devices and methods of making thereofSANDISK 3D LLC·Filed 2008·Granted Mar 15, 2011·21 cites·3 claims
- 0590US8987119B2Pillar devices and methods of making thereofDUNTON VANCE·Filed 2011·Granted Mar 24, 2015·15 cites·35 claims
- 0690US7312139B2Method of fabricating nitrogen-containing gate dielectric layer and semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2005·Granted Dec 25, 2007·18 cites·30 claims
- 0790US7129172B2Bonded wafer processing methodINTEL CORP·Filed 2004·Granted Oct 31, 2006·45 cites·22 claims
- 0890US6623833B2Towel fold configurationKIMBERLY CLARK CO·Filed 2001·Granted Sep 23, 2003·29 cites·9 claims
- 0987US7981592B2Double patterning methodSANDISK 3D LLC·Filed 2008·Granted Jul 19, 2011·12 cites·29 claims
- 1087US7973407B2Three-dimensional stacked substrate arrangementsINTEL CORP·Filed 2008·Granted Jul 5, 2011·12 cites·12 claims
- 1186US5986893AApparatus for controlling the impedance of high speed signals on a printed circuit boardCOMPAQ COMPUTER CORP·Filed 1998·Granted Nov 16, 1999·53 cites·22 claims
- 1286US5499026AConductive touch pad with capacitive blocking filterVARITRONIX LTD·Filed 1994·Granted Mar 12, 1996·62 cites·6 claims
- 1384US6378726B1Interfolded napkin dispensing systemKIMBERLY CLARK CO·Filed 1996·Granted Apr 30, 2002·56 cites·2 claims
- 1483US10681832B1High-density universally-configurable system board architecture with dual-use modular mid-board optics (MBOs)HEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Jun 9, 2020·3 cites·20 claims
- 1580US8203208B2Three-dimensional stacked substrate arrangementsRAMANATHAN SHRIRAM·Filed 2011·Granted Jun 19, 2012·4 cites·7 claims
- 1676US7682942B2Method for reducing pillar structure dimensions of a semiconductor deviceSANDISK 3D LLC·Filed 2007·Granted Mar 23, 2010·5 cites·8 claims
- 1770US8178286B2Double patterning methodCHAN MICHAEL·Filed 2011·Granted May 15, 2012·2 cites·15 claims
- 1870US8148230B2Method of making damascene diodes using selective etching methodsDUNTON VANCE·Filed 2010·Granted Apr 3, 2012·3 cites·4 claims
- 1968US7047333B2Method for the serial transfer of data between two electronic bus stations and communication systemTHOMSON LICENSING·Filed 2002·Granted May 16, 2006·18 cites·15 claims
- 2068US6286713B1Dispensing system for individual folded websKIMBERLY CLARK CO·Filed 1997·Granted Sep 11, 2001·32 cites·20 claims
- 2166US8084366B2Modified DARC stack for resist patterningCHAN MICHAEL·Filed 2008·Granted Dec 27, 2011·2 cites·30 claims
- 2264US5716691ADispensable folded web productKIMBERLY CLARK CO·Filed 1996·Granted Feb 10, 1998·29 cites·21 claims
- 2362US6352172B1Folded web product dispensing systemFiled 1997·Granted Mar 5, 2002·26 cites·8 claims
- 2459US7099966B2Point-to-point electrical loading for a multi-drop busHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Aug 29, 2006·6 cites·40 claims
- 2544US11404601B2Conductive micro LED architecture for on-wafer testingAPPLE INC·Filed 2020·Granted Aug 2, 2022·0 cites·12 claims
- 2640US2005003650A1Three-dimensional stacked substrate arrangementsFiled 2003·Application pending·0 cites
- 2737US2001020626A1Interfolded dispenser napkinsFiled 2001·Application pending·0 cites
- 2832US8481394B2Memory cell that includes a carbon-based memory element and methods of forming the sameCHAN MICHAEL Y·Filed 2010·Granted Jul 9, 2013·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →