Inventor · disambiguated record
Ming-Fa Chen
Also filed as: CHEN MING · CHEN MING-FA
440 granted patents·135 pending applications·2,730 citations·filing 1997–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD505TAIWAN SEMICONDUCTOR MFG24CHEN MING-FA14IND TECH RES INST9CREDO BIOMEDICAL PTE LTD5
Top patents by PatentIndex Score
575 records- 0199US11908836B2Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·6 cites·20 claims
- 0299US11658069B2Method for manufacturing a semiconductor device having an interconnect structure over a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·9 cites·20 claims
- 0399US11482649B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·9 cites·20 claims
- 0499US11404404B2Semiconductor structure having photonic die and electronic dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·6 cites·20 claims
- 0599US11362065B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·8 cites·14 claims
- 0699US11347001B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·6 cites·20 claims
- 0799US11315855B2Package structure with photonic die and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·11 cites·20 claims
- 0899US11233035B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·8 cites·20 claims
- 0999US10541228B2Packages formed using RDL-last processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 21, 2020·51 cites·20 claims
- 1099US10541227B2System on integrated chips and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 21, 2020·47 cites·20 claims
- 1199US10522449B2Packages with Si-substrate-free interposer and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·57 cites·20 claims
- 1299US10510650B2Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·67 cites·20 claims
- 1399US10510629B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·38 cites·20 claims
- 1499US9859254B1Semiconductor structure and a manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·102 cites·20 claims
- 1599US9524959B1System on integrated chips and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 20, 2016·67 cites·20 claims
- 1698US12261163B2Molded dies in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·4 cites·18 claims
- 1798US11749729B2Semiconductor device, integrated circuit component and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·6 cites·20 claims
- 1898US11742297B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·4 cites·20 claims
- 1998US11728247B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·4 cites·14 claims
- 2098US11610858B2Packages with Si-substrate-free interposer and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 21, 2023·5 cites·21 claims
- 2198US11502062B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·12 cites·20 claims
- 2298US11456240B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 2398US11424191B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 2498US11387209B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·4 cites·20 claims
- 2598US11380598B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·4 cites·20 claims
- 2698US11362066B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·5 cites·20 claims
- 2798US11362069B2Three-dimensional stacking structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·4 cites·20 claims
- 2898US11342297B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·4 cites·20 claims
- 2998US11309223B2Method of forming semiconductor device package having dummy devices on a first dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·7 cites·20 claims
- 3098US11264343B2Bond pad structure for semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·5 cites·20 claims
- 3198US11239205B2Integrating passive devices in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·11 cites·20 claims
- 3298US10840190B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·24 cites·20 claims
- 3398US10504873B13DIC structure with protective structure and method of fabricating the same and packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·24 cites·20 claims
- 3498US10373885B23D stacked-chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 6, 2019·49 cites·20 claims
- 3598US10290571B2Packages with si-substrate-free interposer and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·23 cites·20 claims
- 3698US10157867B1Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·39 cites·20 claims
- 3798US10074618B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·19 cites·20 claims
- 3898US9899355B2Three-dimensional integrated circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·71 cites·16 claims
- 3998US9698081B23D chip-on-wafer-on-substrate structure with via last processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 4, 2017·32 cites·20 claims
- 4098US8803292B2Through-substrate vias and methods for forming the sameCHEN MING-FA·Filed 2012·Granted Aug 12, 2014·383 cites·8 claims
- 4198US8378480B2Dummy wafers in 3DIC package assembliesTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·52 cites·11 claims
- 4297US12266612B2Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·2 cites·20 claims
- 4397US12210187B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·2 cites·20 claims
- 4497US12199024B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 14, 2025·2 cites·20 claims
- 4597US11960127B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 16, 2024·2 cites·20 claims
- 4697US11955433B2Package-on-package deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·3 cites·20 claims
- 4797US11862599B2Bonding to alignment marks with dummy alignment marksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·3 cites·20 claims
- 4897US11854921B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·4 cites·20 claims
- 4997US11854785B2Package structure for heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 5097US11848246B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·3 cites·20 claims
Showing the top 50 of 575 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →