Inventor · disambiguated record

Ming-Tsu Chung

Also filed as: CHUNG MING-TSU

20 granted patents·24 pending applications·29 citations·filing 2011–2025

92Inventor score

Technology areasH10W H10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD43 LIU YUAN-HUNG1

Top patents by PatentIndex Score

44 records

0193US11101240B2Isolation bonding film for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·7 cites·20 claims
0288US9449898B2Semiconductor device having backside interconnect structure through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·6 cites·20 claims
0387US9786580B2Self-alignment for redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 10, 2017·8 cites·17 claims
0485US10510641B2Semiconductor device having backside interconnect structure on through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·3 cites·18 claims
0585US2025266325A1Semiconductor Device Having Backside Interconnect Structure on Through Substrate ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0684US12322680B2Semiconductor device having backside interconnect structure on through substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
0782US12362315B2Heterogeneous dielectric bonding schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
0880US12087732B2Isolation bonding film for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
0980US2024387449A1Heterogeneous dielectric bonding schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1080US2025349553A1Stealth patterning formation for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1179US2024363411A1Tsv structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1277US11056419B2Semiconductor device having backside interconnect structure on through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·1 cites·19 claims
1376US12074064B2TSV structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
1476US9059262B2Integrated circuits including conductive structures through a substrate and methods of making the sameLIU YUAN-HUNG·Filed 2011·Granted Jun 16, 2015·4 cites·20 claims
1576US2025343162A1Warpage modulation through implantation and the structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1675US11823979B2Method of forming semiconductor device having backside interconnect structure on through substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·20 claims
1775US2025343164A1Semiconductor structure with stress relief layer and the methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1875US2025343186A1Bond features for reducing non-bond and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1975US2025336687A1Packages with implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2075US2025343165A1Packaged device with air gap and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2175US2025343123A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2273US11869869B2Heterogeneous dielectric bonding schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 9, 2024·0 cites·20 claims
2373US11721666B2Isolation bonding film for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
2471US12489016B2Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
2571US11527439B2TSV structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
2670US2024363359A1Stealth Patterning Formation for Bonding ImprovementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
2770US2025210540A1Semiconductor structure with stress relief layer and the methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2870US2025062136A1Packages with ImplantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
2969US2025062247A1Warpage Modulation Through Implantation and the Structures ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3069US2025062204A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3169US2025070045A1Packaged device with air gap and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3267US2025006677A1Bond Features For Reducing Non-Bond and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3362US11004741B2Profile of through via protrusion in 3DIC interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·0 cites·20 claims
3459US2025239564A1Treatment process for wafer bonding processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3558US10566237B2Profile of through via protrusion in 3DIC interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 18, 2020·0 cites·20 claims
3658US2025191941A1Method and apparatus for bonding semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3758US2025277752A1Optical inspection system, method of optical inspection, and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3857US2024312952A1Bonding Semiconductor Dies Through Wafer Bonding ProcessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3957US2024379505A1Bond Films for Reduced Thermal Resistance and Methods Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4056US2025149497A1Bonding tool and chip-on-wafer bonding processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4155US10163705B2Profile of through via protrusion in 3DIC interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 25, 2018·0 cites·20 claims
4254US2024321694A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4353US10074595B2Self-alignment for redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·0 cites·20 claims
4450US9773701B2Methods of making integrated circuits including conductive structures through substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 26, 2017·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →