Inventor · disambiguated record
Michael S. Cranmer
Also filed as: CRANMER MICHAEL S
8 granted patents·1 pending application·49 citations·filing 2001–2017
83Inventor score
Top patents by PatentIndex Score
9 records- 0194US9607973B1Method for establishing interconnects in packages using thin interposersGLOBALFOUNDRIES INC·Filed 2015·Granted Mar 28, 2017·10 cites·10 claims
- 0290US10002835B2Structure for establishing interconnects in packages using thin interposersGLOBALFOUNDRIES INC·Filed 2017·Granted Jun 19, 2018·6 cites·8 claims
- 0378US6676784B2Process for the manufacture of multilayer ceramic substratesIBM·Filed 2001·Granted Jan 13, 2004·20 cites·13 claims
- 0463US7088000B2Method and structure to wire electronic devicesIBM·Filed 2004·Granted Aug 8, 2006·11 cites·19 claims
- 0554US7873936B2Method for quantifying the manufactoring complexity of electrical designsIBM·Filed 2008·Granted Jan 18, 2011·1 cites·25 claims
- 0653US8645875B2Method for quantifying the manufacturing complexity of electrical designsCRANMER MICHAEL S·Filed 2010·Granted Feb 4, 2014·1 cites·4 claims
- 0744US2007169600A1Method and structure to enable fine grid mlc technologyIBM·Filed 2006·Application pending·0 cites
- 0839US9953900B2Transistor structures gated using a conductor-filled via or trenchGLOBALFOUNDRIES INC·Filed 2016·Granted Apr 24, 2018·0 cites·15 claims
- 0939US7325213B2Nested design approachIBM·Filed 2005·Granted Jan 29, 2008·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →